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Transphorm Announces New 70 million Investment Led by KKR

Transphorm Announces New 70 million Investment Led by KKR

Transphorm Inc, an early stage semiconductor company focused on redefining power conversion, announced a $70 million investment round led by global…


new products Aug 01, 2015 by Transphorm
A World of Freedom and Peace

A World of Freedom and Peace

Is it a dream that never will be true? I was born during a time of peace and freedom in my small region. As a child I watched the results of the war,


tech insights Aug 01, 2015 by Bodo Arlt
China  a Challenging but Important  Market Place for Power Electronics

China a Challenging but Important Market Place for Power Electronics

Also there is a slowdown in same market segments this year China remains the most dynamic, extremely competitive but also challenging marketplace…


tech insights Aug 01, 2015 by Leo Lorenz
August 2015 Electronics Industry Digest

August 2015 Electronics Industry Digest

SEMICONDUCTORS Cypress Semiconductor and Uphill Investment continue to evolve their respective offers to acquire Integrated Silicon Solutions (ISSI).


Lets Get Social in China

Lets Get Social in China

When you think of social media, what comes to mind? Facebook? Twitter? Instagram? Of course, these social media platforms are being used by people


tech insights Aug 01, 2015 by Gavin Hsu
More Power and Higher Reliability by 7th Generation IGBT Module with New SLC Technology

More Power and Higher Reliability by 7th Generation IGBT Module with New SLC Technology

This article highlights Mitsubishi Electric Corporation SLC package technology is combined with the 7th Gen Chip in the NX-type IGBT Modules Series.


New Ways to Produce Fast Power Thyristors

New Ways to Produce Fast Power Thyristors

This article covers methods utilized at manufacturing of fast power thyristors by means of low-temperature junction of silicon chips with…


Numerical Modeling in Design  for Reliability of Power Modules

Numerical Modeling in Design for Reliability of Power Modules

This article sums up relevant failure modes as well as their causes and explains how numerical modelling can support design processes of development.


SMT Hybrid Packaging 2015 How to Package Future Power Components

SMT Hybrid Packaging 2015 How to Package Future Power Components

This article discusses the Surface Mount Technology Hybrid Packaging 2015, an exhibition aimed to inform visitors about the latest trends in…


GaN Systems signs Shenzhen-based Distribution Partner

GaN Systems signs Shenzhen-based Distribution Partner


News Jul 29, 2015 by Jeff Shepard
MIT Spinout enters GaN Power Race

MIT Spinout enters GaN Power Race

Packaging Layout improves FET Thermal Performance

Packaging Layout improves FET Thermal Performance

ADI joins Trustworthy and Secure Semiconductor Initiative

ADI joins Trustworthy and Secure Semiconductor Initiative


News Jul 19, 2015 by Jeff Shepard
200mm Diameter SiC Wafers Revealed

200mm Diameter SiC Wafers Revealed


News Jul 16, 2015 by Jeff Shepard
Tabuchi Electric Enters US Market with SiC PV Inverter

Tabuchi Electric Enters US Market with SiC PV Inverter

GaN Power Integrated Circuit for Wireless Power Transfer

GaN Power Integrated Circuit for Wireless Power Transfer

Compound Semiconductor Commercialization in Wales

Compound Semiconductor Commercialization in Wales


News Jul 09, 2015 by Jeff Shepard
Cree aims to Disrupt SiC Market with APEI Acquisition

Cree aims to Disrupt SiC Market with APEI Acquisition


News Jul 09, 2015 by Jeff Shepard
Replacement of Electromechanical Relays

Replacement of Electromechanical Relays

Infineon Technologies AG rolls out its HITFET™+ family of protected low-side switches


4500V 1200A IEGT Module Launched

4500V 1200A IEGT Module Launched

Toshiba Electronics Europe has launched a high – current 4500V, 1200A power module for use in rail traction, industrial motor control, renewable…