This article highlights Mitsubishi Electric Corporation SLC package technology is combined with the 7th Gen Chip in the NX-type IGBT Modules Series.
This article highlights Mitsubishi Electric Corporation SLC package technology is combined with the 7th Gen Chip in the NX-type IGBT Modules Series.
This article covers methods utilized at manufacturing of fast power thyristors by means of low-temperature junction of…
This article covers methods utilized at manufacturing of fast power thyristors by means of low-temperature junction of silicon chips with…
This article sums up relevant failure modes as well as their causes and explains how numerical modelling can support…
This article sums up relevant failure modes as well as their causes and explains how numerical modelling can support design processes of development.
This article discusses the Surface Mount Technology Hybrid Packaging 2015, an exhibition aimed to inform visitors about…
This article discusses the Surface Mount Technology Hybrid Packaging 2015, an exhibition aimed to inform visitors about the latest trends in…
Infineon Technologies AG rolls out its HITFET™+ family of protected low-side switches
Infineon Technologies AG rolls out its HITFET™+ family of protected low-side switches
Toshiba Electronics Europe has launched a high – current 4500V, 1200A power module for use in rail traction,…
Toshiba Electronics Europe has launched a high – current 4500V, 1200A power module for use in rail traction, industrial motor control, renewable…
CISSOID releases CHT-PLUTO, a high-temperature power module that can operate reliably between -55°C and +225°C and can…
CISSOID releases CHT-PLUTO, a high-temperature power module that can operate reliably between -55°C and +225°C and can deliver up to 60A
GaN Systems Inc. launches the latest addition to its successful range of E-mode GaN-on-Silicon high power transistors…
GaN Systems Inc. launches the latest addition to its successful range of E-mode GaN-on-Silicon high power transistors based on its three core…
Integrated Device Technology announced its collaboration with Efficient Power Conversion (EPC) to develop technology…
Integrated Device Technology announced its collaboration with Efficient Power Conversion (EPC) to develop technology based on Gallium nitride
ROHM Semiconductor presented its IPM (Intelligent Power Module) family optimized for high speed and power-efficient…
ROHM Semiconductor presented its IPM (Intelligent Power Module) family optimized for high speed and power-efficient operation in motor driving and…
Toshiba Electronics Europe (TEE) has expanded its family of ultra-high-efficiency, low-voltage MOSFETs by adding new 30V…
Toshiba Electronics Europe (TEE) has expanded its family of ultra-high-efficiency, low-voltage MOSFETs by adding new 30V and 60V devices to the…
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