Latest Semiconductors Articles

Using DC-DC Converters in Parallel

This article discusses methods in using two DC-DC converters in parallel operation for better reliability and redundancy for devices.

Technical Articles May 06, 2016 by Arthur Russell

Nexeon Raises £30 million for Silicon-Anode Li-ions

News May 05, 2016 by Jeff Shepard

Packaging for High-Voltage GaN Power Transistors

News May 04, 2016 by Power Pulse1595211359

Online Circuit Simulation supports SiC Devices

News May 04, 2016 by Power Pulse1595211359

Littelfuse to unveil new SiC Products at PCIM

new products May 04, 2016 by Power Pulse1595211359

1200V SiC MOSFET with 45-milliOhm On-Resistance

new products May 04, 2016 by Jeff Shepard

SiC for safeguarding AC and DC power circuitry

This article discusses the novel Silicon Carbine based hybrid surge suppressor module for safeguarding AC and DC power…

This article discusses the novel Silicon Carbine based hybrid surge suppressor module for safeguarding AC and DC power circuitry and its benefits.

Technical Articles May 02, 2016 by Dominique Tournier

Reference Design for Inverters: First integrated solution for e-mobility and industry

This article discusses the TDK and Infineon's new integrated solution for inverters for e-mobility power trains and…

This article discusses the TDK and Infineon's new integrated solution for inverters for e-mobility power trains and industrial applications.

Technical Articles May 01, 2016 by Wolfgang Rambow

28V 30W GaN HEMT Die now Available

new products Apr 28, 2016 by Jeff Shepard

GaN Transistors in Inverters, Motors, and Power Modules

News Apr 27, 2016 by Power Pulse1595211359

Wolfspeed SiC MOSFETs, Schottkys and Modules

News Apr 27, 2016 by Power Pulse1595211359

IGBT Enhances Energy Efficiency in Inverters

new products Apr 27, 2016 by Jeff Shepard

MACOM Sues Infineon over GaN Technology

News Apr 26, 2016 by Jeff Shepard

DC-DC Converters can Drive SiC MOSFETs

new products Apr 26, 2016 by Jeff Shepard

Six Videos Featuring GaN Technology Applications

News Apr 25, 2016 by Jeff Shepard

600-V GaN FET Power Stage

new products Apr 24, 2016 by Jeff Shepard

Increased Packing Density From Double-Sided Power Semiconductor Cooling

This article discusses the method of increasing packing density of power electronics using Chip-on-Heatsink Technology…

This article discusses the method of increasing packing density of power electronics using Chip-on-Heatsink Technology for better thermal management.

Technical Articles Apr 22, 2016 by Roland Dische

Thermal Management Materials for SiC and GaN Devices

new products Apr 21, 2016 by Jeff Shepard

MPAC-Doherty devices Support GaN PA Frequencies

new products Apr 19, 2016 by Jeff Shepard

AIX G5+ C Qualified for Production of imec GaN-on-Si Materials

News Apr 18, 2016 by Jeff Shepard