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Online Circuit Simulation supports SiC Devices

Online Circuit Simulation supports SiC Devices

News May 04, 2016 by Power Pulse1595211359
Littelfuse to unveil new SiC Products at PCIM

Littelfuse to unveil new SiC Products at PCIM

new products May 04, 2016 by Power Pulse1595211359
1200V SiC MOSFET with 45-milliOhm On-Resistance

1200V SiC MOSFET with 45-milliOhm On-Resistance

new products May 04, 2016 by Jeff Shepard
SiC for safeguarding AC and DC power circuitry

SiC for safeguarding AC and DC power circuitry

This article discusses the novel Silicon Carbine based hybrid surge suppressor module for safeguarding AC and DC power circuitry and its benefits.

Technical Articles May 02, 2016 by Dominique Tournier
Reference Design for Inverters: First integrated solution for e-mobility and industry

Reference Design for Inverters: First integrated solution for e-mobility and industry

This article discusses the TDK and Infineon's new integrated solution for inverters for e-mobility power trains and industrial applications.

Technical Articles May 01, 2016 by Wolfgang Rambow
28V 30W GaN HEMT Die now Available

28V 30W GaN HEMT Die now Available

new products Apr 28, 2016 by Jeff Shepard
GaN Transistors in Inverters, Motors, and Power Modules

GaN Transistors in Inverters, Motors, and Power Modules

News Apr 27, 2016 by Power Pulse1595211359
Wolfspeed SiC MOSFETs, Schottkys and Modules

Wolfspeed SiC MOSFETs, Schottkys and Modules

News Apr 27, 2016 by Power Pulse1595211359
IGBT Enhances Energy Efficiency in Inverters

IGBT Enhances Energy Efficiency in Inverters

new products Apr 27, 2016 by Jeff Shepard
MACOM Sues Infineon over GaN Technology

MACOM Sues Infineon over GaN Technology

News Apr 26, 2016 by Jeff Shepard
DC-DC Converters can Drive SiC MOSFETs

DC-DC Converters can Drive SiC MOSFETs

new products Apr 26, 2016 by Jeff Shepard
Six Videos Featuring GaN Technology Applications

Six Videos Featuring GaN Technology Applications

News Apr 25, 2016 by Jeff Shepard
600-V GaN FET Power Stage

600-V GaN FET Power Stage

new products Apr 24, 2016 by Jeff Shepard
Increased Packing Density From Double-Sided Power Semiconductor Cooling

Increased Packing Density From Double-Sided Power Semiconductor Cooling

This article discusses the method of increasing packing density of power electronics using Chip-on-Heatsink Technology for better thermal management.

Technical Articles Apr 22, 2016 by Roland Dische
Thermal Management Materials for SiC and GaN Devices

Thermal Management Materials for SiC and GaN Devices

new products Apr 21, 2016 by Jeff Shepard
MPAC-Doherty devices Support GaN PA Frequencies

MPAC-Doherty devices Support GaN PA Frequencies

new products Apr 19, 2016 by Jeff Shepard
AIX G5+ C Qualified for Production of imec GaN-on-Si Materials

AIX G5+ C Qualified for Production of imec GaN-on-Si Materials

News Apr 18, 2016 by Jeff Shepard
USCi and Elettromeccanica ECC SpAto sign Distribution Agreement

USCi and Elettromeccanica ECC SpAto sign Distribution Agreement

United Silicon Carbide Inc. (USCi) a leading manufacturer for SiC devices located in Monmouth Junction, New Jersey announces a distribution…

new products Apr 17, 2016 by United Silicon Carbide
Innovation Award 2016 and the Young Engineer Award

Innovation Award 2016 and the Young Engineer Award

The jury has decided to give the SEMIKRON Innovation Award 2016 to a researcher team from Erlangen for its innovation on 'Zero Tolerance -…

new products Apr 17, 2016 by SEMIKRON
IX2120B Drives Both High Side and Low Side IGBTs or MOSFETs

IX2120B Drives Both High Side and Low Side IGBTs or MOSFETs

IXYS Integrated Circuits Division (ICD), Inc., a wholly owned subsidiary of IXYS Corporation (NASDAQ: IXYS), announced the immediate availability…

new products Apr 17, 2016 by IXYS