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Automotive Three-Phase Isolated MOSFET Driver IC

Automotive Three-Phase Isolated MOSFET Driver IC

Applying Silver Low-Temperature Sintering Technology

Applying Silver Low-Temperature Sintering Technology

This article discusses the application of technologies of low-temperature sintering of silicon wafers and molybdenum discs using the silver…


48W Aux. Power Supply Evaluation Board for SiC FETs

48W Aux. Power Supply Evaluation Board for SiC FETs

Unidirectional ESD Protection in a 01005 Flip Chip Package Introduced

Unidirectional ESD Protection in a 01005 Flip Chip Package Introduced

Littelfuse, Inc. introduces its new series of three unidirectional TVS diode arrays in space-saving 01005 flip-chip packages


new products Feb 13, 2017 by Littelfuse
IEDM 2016 Showcases the Latest Technology Developments in MicroNanoelectronics and Power Devices

IEDM 2016 Showcases the Latest Technology Developments in MicroNanoelectronics and Power Devices

The 62nd annual IEEE International Electron Devices Meeting, (IEDM) was held in San Francisco, California, USA December 3 - 7, 2016. For more than six


tech insights Feb 13, 2017 by Gary Dolny
GaN Transistor Gate Drive Optocouplers

GaN Transistor Gate Drive Optocouplers

This article features Broadcom's Gallium Nitride (GaN) Transistor Gate Drive Optocouplers and discusses its advantages, marketing, drive and…


NY-PEMC Fabs Initial 150mm SiC-Based Patterned Wafers

NY-PEMC Fabs Initial 150mm SiC-Based Patterned Wafers


News Feb 12, 2017 by Jeff Shepard
SiC Computer Chips for Longer Venus Surface Missions

SiC Computer Chips for Longer Venus Surface Missions


News Feb 12, 2017 by Jeff Shepard
Arduino Shield for Easier and Faster Stepper Motor Driver Designs

Arduino Shield for Easier and Faster Stepper Motor Driver Designs

At SPS in Nuremberg ROHM Semiconductor presented its Arduino-based evaluation kit (EVK) to support the evaluation of its motor driver devices as…


new products Feb 10, 2017 by ROHM
The Next Generation Bimode Insulated Gate Transistors Based on Enhanced Trench Technology

The Next Generation Bimode Insulated Gate Transistors Based on Enhanced Trench Technology

This article demonstrate the next step in device evolution can be achieved by combining the ET-IGBT MOS cell and the BIGT integration structure.


£4.3 Million for GaN-on-Diamond Microwave Power

£4.3 Million for GaN-on-Diamond Microwave Power


News Feb 09, 2017 by Jeff Shepard
Using a Modular Power Stage to Rapidly Prove the Design of a 14 kW, 800 V LLC

Using a Modular Power Stage to Rapidly Prove the Design of a 14 kW, 800 V LLC

This article shows a modular power stage from Converter Technology that can rapidly prove the design of a 14kW, 800V LLC topology


Power Module Design for Automotive and CAV Traction Drives

Power Module Design for Automotive and CAV Traction Drives

This article highlights Infineon Technologies North America Power Module designs that illustrate the importance of a holistic design approach.


650V GaN Power ICs get Production Qualification

650V GaN Power ICs get Production Qualification


News Feb 06, 2017 by Jeff Shepard
Motor Control for SiC Drives Embedded in Automotive MCUs

Motor Control for SiC Drives Embedded in Automotive MCUs

International Electron Devices Meeting – IEDM 2016

International Electron Devices Meeting – IEDM 2016

This article discusses the 62nd annual IEEE International Electron Devices Meeting that was held in San Francisco, California, USA.


tech insights Feb 04, 2017 by Gary Dolny
Record Revenue at Silicon Labs for Q4 and Full Year 2016

Record Revenue at Silicon Labs for Q4 and Full Year 2016


News Feb 02, 2017 by Jeff Shepard
GaN Transistor Thermal RC Models Enhance SPICE Simulations

GaN Transistor Thermal RC Models Enhance SPICE Simulations

EU CHALLENGE Project Seeks 3C-SiC Devices for EVs

EU CHALLENGE Project Seeks 3C-SiC Devices for EVs


News Jan 31, 2017 by Jeff Shepard
650V and 1200V SiC Schottkys for Multi-kW Designs

650V and 1200V SiC Schottkys for Multi-kW Designs