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GaN-Based Interleaved CCM Totem Pole Bridgeless PFC Reference Design

GaN-Based Interleaved CCM Totem Pole Bridgeless PFC Reference Design


News Oct 19, 2018 by Paul Shepard
Addressing the Challenges of Utilizing IGBT Technology in Power Modules

Addressing the Challenges of Utilizing IGBT Technology in Power Modules

This article features Vincotech GmbH IGBTs in power modules as it getting thinner, smaller, and faster that complicates their installation in…


Gen-3 SiC JFETs with 1200V and 650V Options

Gen-3 SiC JFETs with 1200V and 650V Options

UnitedSiC Expands SiC JFET Portfolio with Gen3 1200V and 650V Options

UnitedSiC Expands SiC JFET Portfolio with Gen3 1200V and 650V Options

UnitedSiC, a manufacturer of silicon carbide (SiC) power semiconductors, announces its Generation 3 1200 V and 650 V silicon carbide JFETs,…


Controlling Organic Semiconductor Band Gaps by Electron-Acceptor Fluorination

Controlling Organic Semiconductor Band Gaps by Electron-Acceptor Fluorination


News Oct 17, 2018 by Paul Shepard
DC-DCs Optimized for Radio Frequency Power Amplifiers using GaN Transistors

DC-DCs Optimized for Radio Frequency Power Amplifiers using GaN Transistors

Hidden Gapless States on the Path to Semiconductor Nanocrystals

Hidden Gapless States on the Path to Semiconductor Nanocrystals


News Oct 12, 2018 by Paul Shepard
DCM Power Modules Enabling the Electrification of Drive Train Technology

DCM Power Modules Enabling the Electrification of Drive Train Technology

This article highlights Danfoss Silicon Power DCM Power Modules as the next generation technology platform for automotive traction inverters.


SiC Enables EV Charger that is More Efficient & 10X Smaller

SiC Enables EV Charger that is More Efficient & 10X Smaller


News Oct 09, 2018 by Paul Shepard
Porsche Uses SiC FETs in Modular Fast-Charging System Suitable for All EVs

Porsche Uses SiC FETs in Modular Fast-Charging System Suitable for All EVs


News Oct 01, 2018 by Paul Shepard
IGBT Modules Advanced Acoustic Micro Imaging

IGBT Modules Advanced Acoustic Micro Imaging

This article examines the acoustic microimaging of a warped ceramic raft in an IGBT module via the integral acoustic imaging mode developed by…


STMicro and Leti Partner to Develop High-Power GaN-on-Si Devices

STMicro and Leti Partner to Develop High-Power GaN-on-Si Devices


News Sep 24, 2018 by Paul Shepard
Littelfuse Announces 1700V, 1-Ohm SiC MOSFET

Littelfuse Announces 1700V, 1-Ohm SiC MOSFET

STMicroelectronics and Leti Develop GaN-on-Silicon Technology for Power Conversion Applications

STMicroelectronics and Leti Develop GaN-on-Silicon Technology for Power Conversion Applications

STMicroelectronics and Leti today announced their cooperation to industrialize GaN (gallium nitride)-on-silicon technologies for power switching…


TRENCHSTOP IGBT 7 A Good Fit for Industrial Drives

TRENCHSTOP IGBT 7 A Good Fit for Industrial Drives

This article discusses IGBT7 Chip Technology and its benefits to variable-speed drive applications.


Arrow Electronics Appointed by GaN Systems to Supply High-Efficiency Power Products

Arrow Electronics Appointed by GaN Systems to Supply High-Efficiency Power Products


News Sep 19, 2018 by Paul Shepard
650V/60A Bottom-Side-Cooled GaN FET for Space, Military and COTS Designs

650V/60A Bottom-Side-Cooled GaN FET for Space, Military and COTS Designs

GaN Microelectronics for Next-Gen Military and Communications Systems

GaN Microelectronics for Next-Gen Military and Communications Systems

Gaining Speed: Mitsubishi Electric SiC-Power Modules

Gaining Speed: Mitsubishi Electric SiC-Power Modules

The article focuses on high-voltage SiC-modules and gives insights to features and applications.


ECPE Partners with Japanese Researchers on ISOGap and SiC-DCBreaker WBG Projects

ECPE Partners with Japanese Researchers on ISOGap and SiC-DCBreaker WBG Projects


News Sep 14, 2018 by Paul Shepard