This article presents the LoPak1 module created through a holistic design approach and elaborated on the significant…
This article presents the LoPak1 module created through a holistic design approach and elaborated on the significant improvements of the module.
Bel Power Solutions announces the new LDX-B20, a microprocessor-controlled buffer unit rated at 20A and usable in 12, 24,…
Bel Power Solutions announces the new LDX-B20, a microprocessor-controlled buffer unit rated at 20A and usable in 12, 24, 48 and 72 V systems.
Littelfuse, Inc. introduced four new series of 1200V silicon carbide (SiC) Schottky Diodes from its GEN2 product family
Littelfuse, Inc. introduced four new series of 1200V silicon carbide (SiC) Schottky Diodes from its GEN2 product family
This article highlights how simulation apps can help evaluate the effects of heat in capacitors and optimize custom…
This article highlights how simulation apps can help evaluate the effects of heat in capacitors and optimize custom capacitor design.
Littelfuse, Inc., today introduced two series of SIDACtor® protection thyristors optimized to protect equipment located…
Littelfuse, Inc., today introduced two series of SIDACtor® protection thyristors optimized to protect equipment located in high exposure environments
The Programmable Ramp Generator (PRG), featured on several recent 8-bit PIC microcontrollers from Microchip Technology,…
The Programmable Ramp Generator (PRG), featured on several recent 8-bit PIC microcontrollers from Microchip Technology, is a highly flexible…
This article describes the benefits of using highly integrated intelligent power modules which reduces size and assembly…
This article describes the benefits of using highly integrated intelligent power modules which reduces size and assembly time on embedded drive…
This article highlights the benefits of using the new Full SiC MOSFETS in traction applications and flexible converter designs.
This article highlights the benefits of using the new Full SiC MOSFETS in traction applications and flexible converter designs.
Ascatron provides next generation Silicon Carbide (SiC) power semiconductors using its proprietary 3DSiC® technology…
Ascatron provides next generation Silicon Carbide (SiC) power semiconductors using its proprietary 3DSiC® technology with a quality and…
This article highlights the features and advantages of Hioki E.E. Corporation's Memory HiCorder MR6000 which can reach…
This article highlights the features and advantages of Hioki E.E. Corporation's Memory HiCorder MR6000 which can reach sampling speed of 200MS/s.
Toshiba Electronics Europe (TEE) announced the launch of a multi-channel solenoid and unipolar motor driver IC…
Toshiba Electronics Europe (TEE) announced the launch of a multi-channel solenoid and unipolar motor driver IC (TB67S111PG) that delivers…
This article highlights the features of TDK's CeraPad specifically on its integral ESD protection and its superiority to…
This article highlights the features of TDK's CeraPad specifically on its integral ESD protection and its superiority to conventional LEDs.
Intersil, a subsidiary of Renesas Electronics Corporation announced the first three members of its family of…
Intersil, a subsidiary of Renesas Electronics Corporation announced the first three members of its family of radiation-tolerant plastic-package ICs…
Nexperia, the former Standard Products division of NXP, announces a series of Trench 9 power MOSFETs, targeted primarily…
Nexperia, the former Standard Products division of NXP, announces a series of Trench 9 power MOSFETs, targeted primarily at the automotive…
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