This article highlights EPC discrete eGaN FETs and Integrated Circuit ePower™ stages.
This article highlights EPC discrete eGaN FETs and Integrated Circuit ePower™ stages.
The surface mounted units are housed in TO 263-7L package and deliver up to 48 watts with no heatsink required
The surface mounted units are housed in TO 263-7L package and deliver up to 48 watts with no heatsink required
Nexperia is earmarking $700 million to boost production capacity at its wafer fabs and assembly facilities worldwide.
Nexperia is earmarking $700 million to boost production capacity at its wafer fabs and assembly facilities worldwide.
The new single-channel, bidirectional Transient Voltage Suppressors (TVS) provide ESD protection for USB Type-C applications
The new single-channel, bidirectional Transient Voltage Suppressors (TVS) provide ESD protection for USB Type-C applications
The continuing trend towards more efficient energy consumption in motor drives has led to a wide offering of devices for…
The continuing trend towards more efficient energy consumption in motor drives has led to a wide offering of devices for the power stage of…
The tiny buck converters, aimed at USB-PD applications, operate over 7 to 27 VDC inputs and supply 3.3 to 21 VDC
The tiny buck converters, aimed at USB-PD applications, operate over 7 to 27 VDC inputs and supply 3.3 to 21 VDC
The German tech giant opened a new $1.2 billion wafer fab to expand its automotive chip production capacity.
The German tech giant opened a new $1.2 billion wafer fab to expand its automotive chip production capacity.
The new device combines the converter, the inverter and power factor correction (PFC) functionality in a single module
The new device combines the converter, the inverter and power factor correction (PFC) functionality in a single module
Hitachi’s High-Tech subsidiary is building a new semiconductor engineering facility in Oregon, expecting growth across…
Hitachi’s High-Tech subsidiary is building a new semiconductor engineering facility in Oregon, expecting growth across EV, autonomous driving,…
EPC’s CEO and Co-Founder Alex Lidow talks about GaN's biggest application areas and how GaN is in it for the long haul.
EPC’s CEO and Co-Founder Alex Lidow talks about GaN's biggest application areas and how GaN is in it for the long haul.
The new switchers are for the non-isolated buck and buck-boost converters and for isolated flyback designs of up to 12 Watts
The new switchers are for the non-isolated buck and buck-boost converters and for isolated flyback designs of up to 12 Watts
A group of scientists from Japan recently published a study on the development of a supposedly cheaper and non-toxic…
A group of scientists from Japan recently published a study on the development of a supposedly cheaper and non-toxic narrow-gap semiconductor…
A German semiconductor manufacturer selects Oxford Instruments Plasma Technology’s PlasmaPro 100 ALE solution for…
A German semiconductor manufacturer selects Oxford Instruments Plasma Technology’s PlasmaPro 100 ALE solution for creating gallium nitride-based…
The new power management IC (PMIC) channels power to applications and can also serve to charge the same application’s…
The new power management IC (PMIC) channels power to applications and can also serve to charge the same application’s internal battery
In this article, a discussion is given about testing and related results of Silicon-carbide power MOSFETs for automotive…
In this article, a discussion is given about testing and related results of Silicon-carbide power MOSFETs for automotive applications. It reports…
With competing devices spec’d at 6 volts, ROHM’s devices will offer the designer a critical 2-volt edge.
With competing devices spec’d at 6 volts, ROHM’s devices will offer the designer a critical 2-volt edge.
One popular GaN device type is the Cascode GaN FET, which provides even more difficult challenges with its…
One popular GaN device type is the Cascode GaN FET, which provides even more difficult challenges with its oscillation-prone device behavior. In…
Leading semiconductor manufacturers and tech giants are pressuring lawmakers to spend $50 billion on the CHIPS for America Act.
Leading semiconductor manufacturers and tech giants are pressuring lawmakers to spend $50 billion on the CHIPS for America Act.
Facebook
Google
GitHub
Linkedin