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Youthful Power Electronics

Youthful Power Electronics

Computer Engineering is 60 years old. Power Systems and Telecommunications are even older. Forthcoming out of these disciplines the original…

tech insights Dec 01, 2014 by Braham Ferreira
Raytheon UK Developing SiC MOSFETs for Automotive Applications

Raytheon UK Developing SiC MOSFETs for Automotive Applications

News Nov 30, 2014 by Jeff Shepard
gapDRIVE Integrated Digital Gate Drivers feature On-Chip Galvanic Isolation

gapDRIVE Integrated Digital Gate Drivers feature On-Chip Galvanic Isolation

new products Nov 25, 2014 by Jeff Shepard
Compact SiC Hybrid Power Modules handle 3300V and 1500A

Compact SiC Hybrid Power Modules handle 3300V and 1500A

new products Nov 25, 2014 by Jeff Shepard
NXP Acquires Wearable and Bluetooth Low Energy IC Business of Quintic

NXP Acquires Wearable and Bluetooth Low Energy IC Business of Quintic

News Nov 23, 2014 by Jeff Shepard
SiC DIPIPM Power Modules for PV Power Conditioning

SiC DIPIPM Power Modules for PV Power Conditioning

new products Nov 23, 2014 by Jeff Shepard
IC Linearizes Temperature Sensors with 0.1 Degree C Accuracy

IC Linearizes Temperature Sensors with 0.1 Degree C Accuracy

new products Nov 23, 2014 by Jeff Shepard
Gate Driver Board and SPICE Models for SiC Junction Transistors

Gate Driver Board and SPICE Models for SiC Junction Transistors

News Nov 20, 2014 by Jeff Shepard
High-Voltage IC Building Blocks Simplify SMPS Design

High-Voltage IC Building Blocks Simplify SMPS Design

new products Nov 20, 2014 by Jeff Shepard
GaN and SiC may be made Obsolete by Gallium Oxide

GaN and SiC may be made Obsolete by Gallium Oxide

News Nov 19, 2014 by Jeff Shepard
Bond Buffer – Increase Power Density and Lifetime without Changing the System

Bond Buffer – Increase Power Density and Lifetime without Changing the System

This article discusses Danfoss Bond Buffer Technology and its impact on improving power density and lifetime of power modules without changing the…

Technical Articles Nov 19, 2014 by G Mannmeusel
AEC-Q200-Qualified Thin Film Chip Resistors

AEC-Q200-Qualified Thin Film Chip Resistors

new products Nov 17, 2014 by Jeff Shepard
SiC Diodes with Increased Surge-Versus-Normal Current Rating

SiC Diodes with Increased Surge-Versus-Normal Current Rating

new products Nov 17, 2014 by Jeff Shepard
High Power Density Dual nHPD2 Packaging Generation

High Power Density Dual nHPD2 Packaging Generation

This article introduces Hitachi's nHPD2 and its benefits in terms of market potential, performance, modularity and ease of transition.

Technical Articles Nov 17, 2014 by Neil Markham
Gate Driver Targets SiC Devices and IGBTs

Gate Driver Targets SiC Devices and IGBTs

new products Nov 16, 2014 by Power Pulse1595211359
Where is the Journey Headed? The Future of High-Power Semiconductors

Where is the Journey Headed? The Future of High-Power Semiconductors

This article discusses the future of high-power semiconductors in power electronics systems technology of energy savings, dynamics and noise…

Technical Articles Nov 15, 2014 by Hubert Kerstin
SiC-Based Switched-Reluctance Motor Drive from Nidec R&D

SiC-Based Switched-Reluctance Motor Drive from Nidec R&D

News Nov 13, 2014 by Jeff Shepard
Metal Strip Current Sensing Chip Resistors

Metal Strip Current Sensing Chip Resistors

new products Nov 13, 2014 by Jeff Shepard
Monolithic GaN Half-Bridge enables Single-Stage Conversion from 48V to 1V

Monolithic GaN Half-Bridge enables Single-Stage Conversion from 48V to 1V

new products Nov 13, 2014 by Jeff Shepard
Pushing Hall Effect Technology to New Limits

Pushing Hall Effect Technology to New Limits

This article discusses how to use LEM uses Hall Effect Technology to manage fluxgate and improve efficiency, productivity and performance in many…

Technical Articles Nov 13, 2014 by Michel Ghilardi