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Scalability of SiC Near Chip-Scale Packages for Electric Vehicle & Locomotive Traction

Scalability of SiC Near Chip-Scale Packages for Electric Vehicle & Locomotive Traction

This article introduces the µMaxPak, a proprietary power QFN package using automated low-cost QFN assembly technology.


Cree’s $1 Billion Silicon Carbide Expansion Strategy

Cree’s $1 Billion Silicon Carbide Expansion Strategy

A year since the sale of its lighting business unit, a series of strategic partnerships and investments signify Cree’s continued march into the…


News Feb 24, 2020 by Shannon Cuthrell
How Pareto Analysis Helps Determine the Real Benefits of GaN for Power Supplies

How Pareto Analysis Helps Determine the Real Benefits of GaN for Power Supplies


News Feb 24, 2020 by Paul Shepard
Black Phosphorous Tunnel Field-Effect Transistor as an Alternative to CMOS

Black Phosphorous Tunnel Field-Effect Transistor as an Alternative to CMOS


News Feb 23, 2020 by Paul Shepard
STMicroelectronics and TSMC Collaborate to Accelerate Market Adoption of Gallium Nitride-Based Products

STMicroelectronics and TSMC Collaborate to Accelerate Market Adoption of Gallium Nitride-Based Products

STMicroelectronics and TSMC collaborate for the development and delivery of advanced power GaN solutions to market, that leverages…


News Feb 22, 2020 by STMicroelectronics
Automotive 180nm BCD-on-SOI Optimized for Smart Actuators and Power Management

Automotive 180nm BCD-on-SOI Optimized for Smart Actuators and Power Management

X-FAB highlights the availability of new medium-voltage transistors – complementing the company’s leading 180nm BCD-on-SOI technology platform…


new products Feb 21, 2020 by X-Fab
Automotive BCD-on-SOI Platform Optimized for Smart Actuators and Power Management

Automotive BCD-on-SOI Platform Optimized for Smart Actuators and Power Management


News Feb 20, 2020 by Paul Shepard
Indium Corporation Introduces New Ball-Attach and Flip-Chip Flux

Indium Corporation Introduces New Ball-Attach and Flip-Chip Flux

Indium Corporation has expanded its flux portfolio with new Ball-Attach and Flip-Chip Flux designed to be a simple solution for complicated…


X-FAB’s Automotive 180nm BCD-on-SOI Technology Platform Optimized for Smart Actuators and Power Management

X-FAB’s Automotive 180nm BCD-on-SOI Technology Platform Optimized for Smart Actuators and Power Management

X-FAB's announced the availability of new medium-voltage transistors covering voltages from 12V to 32V.


new products Feb 20, 2020 by X-Fab
Teledyne e2v HiRel Announces New HRel 100V GaN Power HEMT

Teledyne e2v HiRel Announces New HRel 100V GaN Power HEMT

STMicro and TSMC Collaborate to Accelerate Gallium Nitride Adoption

STMicro and TSMC Collaborate to Accelerate Gallium Nitride Adoption


News Feb 19, 2020 by Paul Shepard
100V GaN E-HEMT Full Bridge Evaluation Board

100V GaN E-HEMT Full Bridge Evaluation Board

Active Interposer Includes Power Management for 3D Stacked Chiplets

Active Interposer Includes Power Management for 3D Stacked Chiplets


News Feb 19, 2020 by Paul Shepard
CEA-Leti’s Energy-Harvesting ICs Point to Battery-Free Sensor Systems

CEA-Leti’s Energy-Harvesting ICs Point to Battery-Free Sensor Systems

CEA-Leti is investigating harvesting systems to find ambient-energy sources that can power sensor nodes in remote environments.


new products Feb 18, 2020 by Leti
Navitas‘ 65W GaN Charger Solution Chosen by Xiaomi for Mi 10 Pro

Navitas‘ 65W GaN Charger Solution Chosen by Xiaomi for Mi 10 Pro

SiC-Based Totem Pole PFC for Industrial Power Supplies

SiC-Based Totem Pole PFC for Industrial Power Supplies

This article focuses on the AC-to-DC stage with power factor correction


650V Silicon Carbide MOSFET Family offers RDS(on) Down to 27mΩ

650V Silicon Carbide MOSFET Family offers RDS(on) Down to 27mΩ

High Voltage Thick Film Chip Resistor for Automotive Applications

High Voltage Thick Film Chip Resistor for Automotive Applications

Transphorm to Showcase Market Adoption of High Voltage GaN at APEC 2020

Transphorm to Showcase Market Adoption of High Voltage GaN at APEC 2020


News Feb 12, 2020 by Paul Shepard
TI’s New Integrated Transformer Technology Miniaturizes Isolated Power Transfer

TI’s New Integrated Transformer Technology Miniaturizes Isolated Power Transfer

TI’s breakthrough integrated transformer technology enables high-density isolated DC/DC power conversion, while maintaining low EMI.