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USB 3.1 Type C Connectors for Mobile Platforms

USB 3.1 Type C Connectors for Mobile Platforms

Rethinking Power Analysis

Rethinking Power Analysis

This article introduces ZES ZIMMER's innovations to their power analyzers in terms of DUT physical interface, user interface and interface to…


High-Power Surface Mount TVS Diodes

High-Power Surface Mount TVS Diodes

High-Current Board-to-Flex Circuit Connector

High-Current Board-to-Flex Circuit Connector

Increased Power Density and Performance with 3D Embedded Substrate Technologies

Increased Power Density and Performance with 3D Embedded Substrate Technologies

This article discusses the investigation done by PSMA and offers the important core technologies required for embedding substrates.


The Integrated Simulation Environment for Power Modules

The Integrated Simulation Environment for Power Modules

This article highlights Vincotech GmbH integrated simulation environment software designed to provide customers the opportunity to preselect power…


InFORMS vs the Trimmed  Wirebond Technique to Achieve Uniform Bondline Control Between Substrate and Baseplate

InFORMS vs the Trimmed Wirebond Technique to Achieve Uniform Bondline Control Between Substrate and Baseplate

This article discusses TT Electronics and Hybrid testing the inFORMS and discusses the reliability of this interconnect increases in thermal cycles.


Primary Circuit Power Connector Enables Quick Disconnect

Primary Circuit Power Connector Enables Quick Disconnect

Silicone Laminate Adhesive Attaches Power Devices

Silicone Laminate Adhesive Attaches Power Devices

Low Stress Silicone Encapsulant Enables Distributed Power Generation

Low Stress Silicone Encapsulant Enables Distributed Power Generation

This article highlights Dow Corning Corporation EE-3200 Low Stress Silicone Encapsulant that contributes to the penetration of this technology.


Connect LED Arrays Simply and Quickly

Connect LED Arrays Simply and Quickly

EoPlex and MCT partner on 3D Packaging

EoPlex and MCT partner on 3D Packaging


News Sep 20, 2015 by Jeff Shepard
Fuji Electric Opens Engineering and Assembly Facility in Virginia

Fuji Electric Opens Engineering and Assembly Facility in Virginia


News Sep 08, 2015 by Jeff Shepard
New Packaging for More Powerful and Efficient Electronics

New Packaging for More Powerful and Efficient Electronics


News Aug 09, 2015 by Jeff Shepard
Terminal-Style Connector Minimizes LED Shadowing

Terminal-Style Connector Minimizes LED Shadowing

Zener Diodes in Through-Hole and Surface-Mount Packages

Zener Diodes in Through-Hole and Surface-Mount Packages

The First 300mm Inverter Stack Family for Solar Applications

The First 300mm Inverter Stack Family for Solar Applications

The SEMIKUBE SlimLine 3-phase solar inverter completes the SEMIKUBE family with a new solar dedicated product range. Easy cabinet assembly, full…


new products Aug 01, 2015 by SEMIKRON
SMT Hybrid Packaging 2015 How to Package Future Power Components

SMT Hybrid Packaging 2015 How to Package Future Power Components

This article discusses the Surface Mount Technology Hybrid Packaging 2015, an exhibition aimed to inform visitors about the latest trends in…


Frame Core Power Line Chokes with Vertical Design

Frame Core Power Line Chokes with Vertical Design

Packaging Layout improves FET Thermal Performance

Packaging Layout improves FET Thermal Performance