Silicone Laminate Adhesive Attaches Power Devices

The Bergquist Company is excited to introduce the newest product in our Bond-Ply® silicone laminate adhesive line: Bond-Ply® LMS-HD. This thermally conductive, heat curable laminate material was designed to structurally adhere power components and PCB's to a heat sink without the need for mechanical fasteners, such as clips and screws. Bond-Ply® LMS-HD is made up of a high performance, thermally loaded low modulus silicone compound coated on a cured core and double lined with protective films.

Its intrinsic isolation core provides high thermal performance and exceptional dielectric isolation. The low modulus silicone design effectively absorbs the mechanical stresses induced by assembly-level CTE mismatch, shock and vibration, while providing excellent thermal and dielectric performance plus adhesive strength.

Features of Bond-Ply LMS-HD include: TO-220 Thermal performance of 2.3 degrees C/W, initial pressure only lamination; Exceptional dielectric strength; Very low interfacial resistance; Continuous use from -60 to 180 degrees C; and Eliminates mechanical fasteners. It is offered in roll form, die-cut parts and sheet form.