APEC 2025: Solutions that Power the Future, Part 2

Power and energy leaders gathered in Atlanta this week for the APEC 2025 conference to showcase innovative products that simplify design and maximize efficiency.

In Part 2 of EEPower’s on-site coverage, we review innovations ranging from QSPICE circuit simulations to battery management systems, DC power supplies, power conversion, GaN ICs, and more. You can read Part 1 of our APEC series here.

QSpice's creator, Mike Englehardt, with Barbara Vergetis Lundin, EEPower editor-in-chief, at APEC 2025.  Image used courtesy of Carl "Bill" Lundin

Qorvo

Qorvo highlighted an addition to its QSPICE circuit simulation software. QSPICE author Mike Engelhardt indicated that the new feature is the most important circuit simulation upgrade since QSPICE was released in 2023. He describes how to build QSPICE in minutes in this video.

Mike Englehardt with QSPICE update. Image used courtesy of Qorvo

Circuit simulations enable electronic designers and engineers to accurately model semiconductor components and develop designs in a few minutes, which previously took hours to complete. Qorvo’s free QSPICE software package can create circuit simulation models for JFETs, MOSFETs, and diodes using information from datasheets. QSPICE allows designers to easily simulate complex digital circuits and algorithms.

QSPICE software can enable developers to test circuits prior to building prototypes, saving time and money and reducing environmental impact. Qorvo actively supports QSPICE and offers a user community through Qorvo's QSPICE forum.

Renesas Electronics

Renesas Electronics introduced an all-in-one battery management system (BMS) for managing lithium-ion battery packs for products such as e-bikes, vacuum cleaners, robotics, and drones. The R-BMS F (Ready Battery Management System with Fixed Firmware) is designed for lithium-ion batteries in both 2-4 and 3-10 cell series (S) configurations and includes Renesas’ fuel gauge ICs and an integrated microcontroller. Pre-validated firmware can significantly reduce the learning curve for developers of safe, power-efficient battery management systems.

Firmware is essential in battery management systems as it monitors batteries’ state of charge, state of health, current, and temperature. It also actively balances the individual cell voltages and detects faults.

Battery management system. Image used courtesy of Renesas

Renesas’ R-BMS F solutions are equipped with built-in, pre-tested firmware designed specifically to work with the FGIC’s on-board MCU. This firmware includes pre-programmed functions such as cell balancing, current control, and voltage and temperature monitoring to maximize battery life and ensure safe operation. Users can adjust parameters to meet specific requirements, and a graphic user interface allows cell chemistry selection.

Magna-Power Electronics

Magna-Power Electronics revealed the addition of four high-current power supply models to its TS Series product line. The series offers single outputs of 2,500, 5,000, 7,500, and 10,000 amps DC. This complete turn-key system allows current scaling into hundreds of kiloamps through high-performance master-slaving.

TS Series, programmable DC power supply. Image used courtesy of Magna-Power

TS Series models ship with standard 19-inch rack-mount kits; however, the higher-power 8U, 12U, and 16U enclosures include removable casters and expanded rear protections for standalone operation without rack mounting. With this expansion, the TS Series now has 279 different models, ranging from 5 kW to 100 kW, and featuring maximum output currents up to 10,000 ADC per unit and voltage ratings up to 6,000 VDC.

Wise Integration

 Wise Integration featured its WiseWare digital controllers, which use GaN to enable higher performance, system simplification, and seamless integration. GaN device performance characteristics fit the growing power demands of AI-driven servers and industrial requirements.

WiseGan. Image used courtesy of Wise Integration

Wise Integration featured two technical presentations and also unveiled its latest WiseGan (GaN Power IC) and WiseWare (digital AC-DC controller) advances. The synergy between its GaN device, WiseGan, and a 32-bit, MCU-based AC-DC digital controller, WiseWare, can result in applications that are three times smaller, more efficient, and lighter. They also cater to power requirements from 30 W to 7 kW and are suitable for electric vehicle chargers, electronics, and industrial uses.

Enoda

Enoda announced a collaboration with Mersen for the proprietary power electronics of its flagship technology, the Enoda Prime Exchanger, a first-of-a-kind, dynamic power flow hardware technology. The device can automate and enhance power quality in low-voltage networks. It can also strengthen grid stability to improve grid resilience by autonomously balancing three phases, removing damaging harmonics, and correcting power factors, which are critical in power system decarbonization.

The company has released a video that provides a technical animation of the custom power electronics stack and a fireside chat between Enoda founder Andrew Scobie and Philippe Roussel from Mersen.

Enoda Prime Exchanger. Image used courtesy of Enoda

Cambridge GaN Devices

Cambridge GaN Devices highlighted Combo IceGaN, which combines an ICeGaN HeMT and an IGBT in parallel combination and is suitable for high-power EV powertrain applications.

The technology integrates enhancement-mode GaN high electron mobility transistors (HEMTs) with monolithically integrated interface circuitry, allowing them to operate like silicon MOSFETs without requiring negative voltages or external clamping circuits. The breakthrough maximizes efficiency and offers a cost-effective alternative to expensive silicon carbide (SiC) solutions.

Combo ICeGaN solution. Image used courtesy of Cambridge GaN Devices

ICeGaN technology allows EV engineers to use GaN’s benefits in DC-DC converters, EV onboard chargers, and traction inverters. The combination ICeGaN further extends these GaN benefits and will enable the company to address EV powertrain applications over 100 kW, a growing market potentially worth over $10 billion.

Yokogawa Test and Measurement Corporation 

Yokogawa Test and Measurement introduced its AQ6361 optical spectrum analyzer (OSA) at APEC 2025. This benchtop OSA is designed to provide a cost-effective solution for testing data and telecommunication components such as laser diodes, optical transceivers, and optical amplifiers.

The AQ6361 OSA. Image used courtesy of Yokogawa 

Due to the dramatic increase in demand for data centers, companies producing optical devices, modules, and other optical components need higher-performance OSAs that operate faster without sacrificing quality and accuracy. Yokogawa claims its new production-grade AQ6361 achieves up to 20 times the measurement speed of its best-selling AQ6370E model.

Infineon Technologies

Infineon Technologies AG  announced several new products and developments. Included were:

• CoolSiC Schottky diode 2000 V is now available in the TO-247-2 package, enabling higher efficiency and simplifying designs.
• Infineon has extended its XDP™ digital protection product family with new 48 V hot swap controllers optimized for AI servers.
• It has an advanced Powering AI roadmap with cutting-edge battery backup unit technology for AI data centers.
• The company unveiled its next generation of high-density power modules for vertical power delivery in AI data centers.
• Infineon CoolMOS 8 SJ enabled Enphase to reduce MOSFET-related costs and boost energy efficiency.
• Infineon introduced new E-version XDP hybrid flyback controller ICs for ultra-high power density designs.

Infineon’s CoolMOS. Image courtesy of Infineon

Many industrial electronics applications are moving toward higher power levels to minimize power losses. This can be achieved with increased DC voltages. Infineon’s new products can play a pivotal role in developing the next generation of high-density power modules for applications such as AI and high-performance computing.

Nexperia

Nexperia introduced a range of efficient, industrial-grade 1200 V silicon carbide (SiC) MOSFETs called X.PAK. These feature innovative surface-mount (SMD) top-side cooled packaging technology.

X.PAK. Image used courtesy of Nexperia 

The compact package of 14 mm x 18.5 mm combines the assembly benefits of SMD with the cooling efficiency of through-hole technology. Its excellent temperature stability and fast switching speed make it an excellent choice for high-power and high-voltage industrial applications, such as EV charging, solar photovoltaic inverters, and electric motor drives.

Pulsiv

Pulsiv Limited has won the Power Sources Manufacturers Association’s first Global Energy Efficiency Award. 

Pulsiv won the award for its ground-breaking 65W USB-C design, which delivers ultra-low operating temperatures and a peak efficiency of 96 percent. The USB-C design showcases Pulsiv OSMIUM technology, a method of AC to DC front-end conversion that applies intelligence to an active valley fill approach, delivering a combination of benefits in power electronics.