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3.3 kV Full SiC MOSFETs – Towards High-Performance Traction Inverters

3.3 kV Full SiC MOSFETs – Towards High-Performance Traction Inverters

This article highlights the benefits of using the new Full SiC MOSFETS in traction applications and flexible converter designs.


140 × 140 × 38 mm High-Performance Long Life Fans

140 × 140 × 38 mm High-Performance Long Life Fans

Ultra-thin 6W and 10W SMD/DIP DC-DC Converters

Ultra-thin 6W and 10W SMD/DIP DC-DC Converters

Next-Gen 600V Planar MOSFETs with RDS(on) down to 0.65Ω

Next-Gen 600V Planar MOSFETs with RDS(on) down to 0.65Ω

Neutron-Scattering Providing Insights into Magnetism & Superconductivity

Neutron-Scattering Providing Insights into Magnetism & Superconductivity


News Jan 12, 2018 by Paul Shepard
Helix Semi Secures $2 Million Investment from XTRION N.V.

Helix Semi Secures $2 Million Investment from XTRION N.V.


News Jan 11, 2018 by Paul Shepard
U.K. Project Aims at Doubling Range of Next-Generation EVs

U.K. Project Aims at Doubling Range of Next-Generation EVs


News Jan 11, 2018 by Paul Shepard
Lead-type MLCCs for Automotive Designs at 175°C and 200°C

Lead-type MLCCs for Automotive Designs at 175°C and 200°C

GaN enables Ultra Wide-Band Linearized Doherty Amplifier

GaN enables Ultra Wide-Band Linearized Doherty Amplifier

High Pulse Withstanding Resistors offer High Stability and Reliability

High Pulse Withstanding Resistors offer High Stability and Reliability

Carnegie Mellon Extends Research into 3D Micro-Additive Manufacturing

Carnegie Mellon Extends Research into 3D Micro-Additive Manufacturing


News Jan 11, 2018 by Paul Shepard
Pure Sinewave Inverters for Railway Applications

Pure Sinewave Inverters for Railway Applications

Nano Dimension and Techniplas Partner on 3D Printing for Automotive Electronics

Nano Dimension and Techniplas Partner on 3D Printing for Automotive Electronics


News Jan 11, 2018 by Paul Shepard
Artificial Intelligence Chip Delivers 15 Teraflops using under 5 Watts

Artificial Intelligence Chip Delivers 15 Teraflops using under 5 Watts


News Jan 11, 2018 by Paul Shepard
Next Generation Silicon Carbide Power Device with 3DSiC Technology

Next Generation Silicon Carbide Power Device with 3DSiC Technology

Ascatron provides next generation Silicon Carbide (SiC) power semiconductors using its proprietary 3DSiC® technology with a quality and…


new products Jan 11, 2018 by Ascatron
Evaluating Inverter Drive Systems with Highspeed Multichannel Waveform Recordings

Evaluating Inverter Drive Systems with Highspeed Multichannel Waveform Recordings

This article highlights the features and advantages of Hioki E.E. Corporation's Memory HiCorder MR6000 which can reach sampling speed of 200MS/s.


15-Watt Qi-Compliant Wireless Charging Antennas

15-Watt Qi-Compliant Wireless Charging Antennas

Dynex Launches High-Voltage Semiconductor Foundry Business

Dynex Launches High-Voltage Semiconductor Foundry Business


News Jan 10, 2018 by Paul Shepard
NPC Modules with Latest IGBT Chip Tech for up to 120kVA

NPC Modules with Latest IGBT Chip Tech for up to 120kVA

Charger Controllers Support both Li-ion and Li-Polymer Batteries

Charger Controllers Support both Li-ion and Li-Polymer Batteries