This article highlights Raytheon UK’s Semiconductor Business Unit with high-temperature SiC (HiTSiC) technology for an advanced SiC manufacturing…
This article highlights Raytheon UK’s Semiconductor Business Unit with high-temperature SiC (HiTSiC) technology for an advanced SiC manufacturing…
This article introduces DMEGC's new power material DMR91 for high-frequency applications as cores with high flux density…
This article introduces DMEGC's new power material DMR91 for high-frequency applications as cores with high flux density and low loss in power…
This article discusses the method of using Inrush-Current Limiting Wirewound Resistors to Charge the DC-Link Capacitor of…
This article discusses the method of using Inrush-Current Limiting Wirewound Resistors to Charge the DC-Link Capacitor of an Electric Drive System.
This article presents three geometry simulation models of the basic components in an E-car to obtain optimum cable length…
This article presents three geometry simulation models of the basic components in an E-car to obtain optimum cable length and receive suitable EMC.
This article offers a highly integrated solution of improving inverter protection with the use of Toshiba's TLP5214 smart…
This article offers a highly integrated solution of improving inverter protection with the use of Toshiba's TLP5214 smart gate-driver.
This article discusses the best practices of when to use Litz Wire in design process for inductors, transformer, and/or systems.
This article discusses the best practices of when to use Litz Wire in design process for inductors, transformer, and/or systems.
This article discusses the necessary requirements of power supplies to be applied for datacom applications in terms of…
This article discusses the necessary requirements of power supplies to be applied for datacom applications in terms of power density and losses.
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