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Embedding Microbatteries On-chip for Greater Miniaturization

Embedding Microbatteries On-chip for Greater Miniaturization

Researchers develop microbatteries that are as thick as three sheets of paper, and can be embedded into sensor circuitry.


News Oct 05, 2021 by Darshil Patel
Solitron Devices Announces 1200V Silicon Carbide Half Bridge Power Module

Solitron Devices Announces 1200V Silicon Carbide Half Bridge Power Module

The SD11900 series maximizes power density while minimizing loop inductance with a pin configuration to allow simple power bussing.


X-FAB Becomes World’s First Foundry to Offer High-Volume Micro-Transfer Printing

X-FAB Becomes World’s First Foundry to Offer High-Volume Micro-Transfer Printing

X-FAB Semiconductor Foundries announces completion of a licensing agreement with X-Celeprint and becomes world’s first foundry to offer…


News Oct 02, 2021 by Stephanie Leonida
Siemens Introduces a Power Integrity Analytical SW Tool for IC Design

Siemens Introduces a Power Integrity Analytical SW Tool for IC Design

The new package enables EM/IR assessment of analog, digital, and mixed-signal IC designs of any size before committing to silicon.


Efficient Power Conversion (EPC) Debuts a 1.6 mΩ, 40 V eGaN FET

Efficient Power Conversion (EPC) Debuts a 1.6 mΩ, 40 V eGaN FET

The new enhancement mode power transistor features a maximum ID of 80 amps with a die size of only 3.25 x 3.25mm.


Central Semiconductor Releases New CAK3 & CAK6 Series 5G Transient Voltage Suppressors

Central Semiconductor Releases New CAK3 & CAK6 Series 5G Transient Voltage Suppressors

Central Semiconductor Corp., introduces its CAK3-012C & CAK6-042C series of 5G bi-directional transient voltage suppressors (TVS).


LeydenJar Receives Financial Boost to Scale Up Silicon Anode Battery Technology

LeydenJar Receives Financial Boost to Scale Up Silicon Anode Battery Technology

LeydenJar Technologies raises €22 million to scale-up production of fast charging silicon anode super batteries.


News Sep 25, 2021 by Stephanie Leonida
Vishay Intertechnology Enhances Thick Film Chip Resistor in 1206 Case Size With Higher 0.5 W Power Rating

Vishay Intertechnology Enhances Thick Film Chip Resistor in 1206 Case Size With Higher 0.5 W Power Rating

AEC-Q200 Qualified Device Saves Board Space While Lowering Component Counts and Placement Costs.


GaN Systems and BMW Group Enter New Semiconductor Capacity Agreement

GaN Systems and BMW Group Enter New Semiconductor Capacity Agreement

The collaboration will see GaN Systems supply BMW Group with high-performance, automotive-grade GaN power transistors.


Tiny Power Management IC from Analog Devices Charges Wearables and Hearables Four Times Faster

Tiny Power Management IC from Analog Devices Charges Wearables and Hearables Four Times Faster

MAX77659 SIMO PMIC with built-in switching charger reduces bill of materials by 60 percent.


Reduce Switching Losses up to 50% While Accelerating Time to Market with the First Fully Configurable Digital Gate Driver for Silicon Carbide MOSFETs – Now Production Ready

Reduce Switching Losses up to 50% While Accelerating Time to Market with the First Fully Configurable Digital Gate Driver for Silicon Carbide MOSFETs – Now Production Ready

New technology enables electric buses and other e-transportation power systems to meet and exceed stringent environmental conditions while…


Vishay’s RCV-AT Series of Film Chip Resistors Save Board Space, Lower Component Counts

Vishay’s RCV-AT Series of Film Chip Resistors Save Board Space, Lower Component Counts

Vishay Intertechnology introduces a new series of AEC-Q200 qualified thick film chip resistors with operating voltages up to 3 kV in the 2010 and…


Silicon Designs Announces Immediate Availability of MEMS Capacitive Accelerometer Chips

Silicon Designs Announces Immediate Availability of MEMS Capacitive Accelerometer Chips

Silicon Designs, Inc., today announced that three of its industry best-selling industrial-grade surface mount MEMS capacitive accelerometer chip…


Transphorm Acquires AFSW GaN Wafer Fab in Japan

Transphorm Acquires AFSW GaN Wafer Fab in Japan

California semiconductor manufacturer Transphorm closed its acquisition of the high-volume AFSW wafer fab in Japan.


News Sep 17, 2021 by Shannon Cuthrell
AVX Launches New TCO Series High-Temperature, Automotive-Grade Polymer Chip Capacitors

AVX Launches New TCO Series High-Temperature, Automotive-Grade Polymer Chip Capacitors

TCO Series capacitors meet AEC-Q200 requirements, exhibit low DCL and a benign failure mode, and are ideal for use in low- and medium-power…


UnitedSiC Debuts a 750V SiC Power FET with a 6mohm RDS(ON)

UnitedSiC Debuts a 750V SiC Power FET with a 6mohm RDS(ON)

The device features a short-circuit withstand time rating of 5μs and is introduced as part of a series of 9 new devices.


Power Semiconductor Modules to Support Lower Voltages

Power Semiconductor Modules to Support Lower Voltages

This article examines the use of power semiconductors in a low voltage drive with the general architecture.


Infineon and Panasonic to Collaborate on 650V Power GaN Development

Infineon and Panasonic to Collaborate on 650V Power GaN Development

The two companies agree to joint development of the next generation of their successful Gallium Nitride (GaN) technology.


onsemi Acquires GT Advanced Technologies for $415M

onsemi Acquires GT Advanced Technologies for $415M

Onsemi is acquiring SiC materials provider GT Advanced Technologies to meet increased demand in the EV and infrastructure markets.


News Sep 09, 2021 by Shannon Cuthrell
Alpha and Omega Semiconductor Debuts Ideal Diode Reverse Current Protection Switch

Alpha and Omega Semiconductor Debuts Ideal Diode Reverse Current Protection Switch

Alpha and Omega Semiconductor’s (AOS) smart protection switch is aimed at Type-C Power Delivery applications.