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SiC IC Design Process Model Grant from NASA

SiC IC Design Process Model Grant from NASA


News Jul 10, 2016 by Jeff Shepard
Consortium to address Wafer-Level Packaging Challenges

Consortium to address Wafer-Level Packaging Challenges


News Jun 29, 2016 by Jeff Shepard
ABB opens Silicon Valley Campus with IoTSP Focus

ABB opens Silicon Valley Campus with IoTSP Focus


News Jun 29, 2016 by Jeff Shepard
Bluetooth Low Energy Single-Chip Solution

Bluetooth Low Energy Single-Chip Solution

Battery-Charger IC Reduces Cost and Time-to-Market

Battery-Charger IC Reduces Cost and Time-to-Market

Three-Wire True Zero-Speed Magnetic Speed-Sensor IC

Three-Wire True Zero-Speed Magnetic Speed-Sensor IC

3D Silicon Lithium-Ion Battery in Pilot Production

3D Silicon Lithium-Ion Battery in Pilot Production


News Jun 21, 2016 by Jeff Shepard
WPG Americas pens Distribution Agreement with Seoul Semiconductor

WPG Americas pens Distribution Agreement with Seoul Semiconductor


News Jun 14, 2016 by Jeff Shepard
Keeping Cool with a Black Semiconductor

Keeping Cool with a Black Semiconductor


News Jun 13, 2016 by Jeff Shepard
SDK Expands High-Grade SiC Epitaxial Wafer Capacity

SDK Expands High-Grade SiC Epitaxial Wafer Capacity


News Jun 08, 2016 by Jeff Shepard
Enhanced GaN-on-Silicon Epiwafers at be Unveiled

Enhanced GaN-on-Silicon Epiwafers at be Unveiled


News Jun 08, 2016 by Jeff Shepard
Improving Thermal Performance with Chip-Scale Packaged Gallium Nitride Transistors

Improving Thermal Performance with Chip-Scale Packaged Gallium Nitride Transistors

This article discusses the advantages of chip-scale packaging of GaN transistors by evaluating its thermal performance and efficiency.


Metal Composite High-Current Chip Inductors

Metal Composite High-Current Chip Inductors

Overcoming Challenges in Driving Silicon Carbide Power Modules

Overcoming Challenges in Driving Silicon Carbide Power Modules

This article discusses the advancements of AgileSwitch in Programmable Gate Drivers.


AEC-Q200 Qualified Thick-Film Chip Resistors

AEC-Q200 Qualified Thick-Film Chip Resistors

IQE Joins imec’s GaN-on-Silicon Affiliation Program

IQE Joins imec’s GaN-on-Silicon Affiliation Program


News May 15, 2016 by Jeff Shepard
First GaN Power ICs Leave Silicon Behind

First GaN Power ICs Leave Silicon Behind

Navitas Semiconductor announced the world’s first Gallium Nitride (GaN) Power ICs, using its proprietary AllGaN™ monolithically-integrated 650V…


Minister Visit to Danfoss Silicon Power

Minister Visit to Danfoss Silicon Power

Schleswig-Holstein's Minister for Economic Affairs, Labour, Transport and Technology, Reinhard Meyer, visited Danfoss Silicon Power March 4th


Audio IC Enables a New Immersive Headset Experience

Audio IC Enables a New Immersive Headset Experience

Silicon and GaN Transistor Comparison: Optimized Inverter Design

Silicon and GaN Transistor Comparison: Optimized Inverter Design

This article highlights the advantages of GaN E-HMET from GaN Systems over the conventional silicon-based IGBT and MOSFET inverter solutions.