This article discusses the method of increasing packing density of power electronics using Chip-on-Heatsink Technology…
This article discusses the method of increasing packing density of power electronics using Chip-on-Heatsink Technology for better thermal management.
This article highlights Infineon Technologies AG Silicon Carbide transistors development for industrial power electronics…
This article highlights Infineon Technologies AG Silicon Carbide transistors development for industrial power electronics applications and the goal…
Results of theoretical research of influence of cumulative dose on I-V characteristics (IVC) of power semiconductor…
Results of theoretical research of influence of cumulative dose on I-V characteristics (IVC) of power semiconductor devices based on silicon are…
Texas Instruments introduced the first single-chip 100-V high-side FET driver for high-power lithium-ion battery…
Texas Instruments introduced the first single-chip 100-V high-side FET driver for high-power lithium-ion battery applications, delivering advanced…