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Sanyo To Release Thinnest MOSFET For Mobile Devices

Sanyo To Release Thinnest MOSFET For Mobile Devices

new products Apr 06, 2009 by Jeff Shepard
IXYS Extends GenX3 IGBT Family To 1200V

IXYS Extends GenX3 IGBT Family To 1200V

new products Apr 06, 2009 by Jeff Shepard
NEC Electronics America Introduces Four New MOSFET Devices For Portable and Industrial Markets

NEC Electronics America Introduces Four New MOSFET Devices For Portable and Industrial Markets

new products Apr 01, 2009 by Jeff Shepard
Nippon Steel To Enter SiC Wafer Business

Nippon Steel To Enter SiC Wafer Business

News Mar 30, 2009 by Jeff Shepard
Fairchild Semiconductor to Close Two Wafer Fabs

Fairchild Semiconductor to Close Two Wafer Fabs

News Mar 25, 2009 by Jeff Shepard
Infineon & Bosch Sign Collaboration Contract For Power Semiconductors

Infineon & Bosch Sign Collaboration Contract For Power Semiconductors

News Mar 23, 2009 by Jeff Shepard
Honeywell Develops Lead-Free Thermal Management Material For Semiconductors

Honeywell Develops Lead-Free Thermal Management Material For Semiconductors

new products Mar 15, 2009 by Jeff Shepard
Vishay Releases New 20V P-Channel TrenchFET Gen III Power MOSFET

Vishay Releases New 20V P-Channel TrenchFET Gen III Power MOSFET

new products Mar 08, 2009 by Jeff Shepard
IXYS Introduces New 2200V Rectifier Diode For Photovoltaic Systems

IXYS Introduces New 2200V Rectifier Diode For Photovoltaic Systems

new products Mar 05, 2009 by Jeff Shepard
TDK-Lambda’s New Digitally Controlled Power Supplies Meet Medical Specs

TDK-Lambda’s New Digitally Controlled Power Supplies Meet Medical Specs

new products Mar 01, 2009 by Jeff Shepard
Tankeblue Announces Growth Technique Of Silicon Carbide (SiC) Wafers

Tankeblue Announces Growth Technique Of Silicon Carbide (SiC) Wafers

News Feb 25, 2009 by Jeff Shepard
Digi-Key & Powerex Announce Distribution Agreement For North America

Digi-Key & Powerex Announce Distribution Agreement For North America

News Feb 25, 2009 by Jeff Shepard
Mitsubishi Announces 18.9% Conversion Efficiency Rate For Multi-Crystalline Silicon PV Cells

Mitsubishi Announces 18.9% Conversion Efficiency Rate For Multi-Crystalline Silicon PV Cells

News Feb 23, 2009 by Jeff Shepard
ST Introduces MDmesh™ V Power-MOSFET Technology

ST Introduces MDmesh™ V Power-MOSFET Technology

new products Feb 16, 2009 by Jeff Shepard
Westcode Introduces New Water Cooled Heatsink For High Power Semiconductors

Westcode Introduces New Water Cooled Heatsink For High Power Semiconductors

new products Feb 12, 2009 by Jeff Shepard
Power Integrations Settles Patent Litigation With BCD Semiconductor

Power Integrations Settles Patent Litigation With BCD Semiconductor

News Feb 11, 2009 by Jeff Shepard
AMSC & DOE To Collaborate On 10 MW-Class Superconductor Wind Turbines

AMSC & DOE To Collaborate On 10 MW-Class Superconductor Wind Turbines

News Feb 09, 2009 by Jeff Shepard
STMicro Announces Silicon Carbide Schottky Diodes For Solar Power, Server Systems, & Motor Controllers

STMicro Announces Silicon Carbide Schottky Diodes For Solar Power, Server Systems, & Motor Controllers

new products Feb 08, 2009 by Jeff Shepard
Ericsson and ST Complete Deal To Create Joint Venture For Semiconductors & Platforms In Mobile Applications

Ericsson and ST Complete Deal To Create Joint Venture For Semiconductors & Platforms In Mobile Applications

News Feb 02, 2009 by Jeff Shepard
Fraunhofer Announces 41.1% Efficiency Multi-Junction Solar Cells

Fraunhofer Announces 41.1% Efficiency Multi-Junction Solar Cells

News Jan 28, 2009 by Jeff Shepard