New Industry Products

OnChip Introduces Thin Film Multi-tapped Silicon Chip Resistors For Hi-Rel Applications

April 26, 2009 by Jeff Shepard

OnChip introduced a miniature thin film silicon wire-bondable resistor chip that the company says can offer a wide range of values. Using advanced thin-film manufacturing techniques and featuring high-stability, self-passivating and moisture-resistant tantalum nitride resistor elements, this product is well suited for developing quick-turn proto-types in the hybrid microelectronics labs.

The multi-tapped 110R Series resistors are said to provide great flexiblity to hybrid circuit designers. Consisting of a string of 20 resistors, these chips can be wire-bonded to offer a wide range of resistances. Measuring a size of 34 x 34 mils sq., the 110R consists of twenty one wire-bond pads. There are a set of 10 resistors with a value of 2.5kΩ each and another set of 10 resistors with a value of 25kΩ each, adding up to a total resistance of 275kΩ. Since all these resistors are in series and with pads between each, the designer can get any values from 2.5 to 275kΩ depending on what wire-bond pads are used.

The 110R resistors offer TCR (Temperature Coefficient of Resistance) value as low as 250 ppm/°C. TCR Tracking between individual resistors are no more than 10 ppm/°C. . Additionally, these devices provide low shunt capacitance and low-noise operation which are ideal attributes for use in high performance hybrid microelectronics.

These silicon resistor chips feature resistance to thermal shock and high-temperature exposure. They are 100% electrically tested and visually inspected to MIL-STD-883. They are specified for an operating temperature range of -55 to +125°C. Samples are available now, with lead times of 6 weeks for production quantities.

The 110R thin film resistor chips are available immediately worldwide. These devices have production pricing in the range of $3.90 to $7.25, depending on the device tolerance and volume.