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Honeywell Develops Lead-Free Thermal Management Material For Semiconductors

Honeywell Develops Lead-Free Thermal Management Material For Semiconductors

Vishay Releases New 20V P-Channel TrenchFET Gen III Power MOSFET

Vishay Releases New 20V P-Channel TrenchFET Gen III Power MOSFET

IXYS Introduces New 2200V Rectifier Diode For Photovoltaic Systems

IXYS Introduces New 2200V Rectifier Diode For Photovoltaic Systems

TDK-Lambda’s New Digitally Controlled Power Supplies Meet Medical Specs

TDK-Lambda’s New Digitally Controlled Power Supplies Meet Medical Specs

Tankeblue Announces Growth Technique Of Silicon Carbide (SiC) Wafers

Tankeblue Announces Growth Technique Of Silicon Carbide (SiC) Wafers


News Feb 25, 2009 by Jeff Shepard
Digi-Key & Powerex Announce Distribution Agreement For North America

Digi-Key & Powerex Announce Distribution Agreement For North America


News Feb 25, 2009 by Jeff Shepard
Mitsubishi Announces 18.9% Conversion Efficiency Rate For Multi-Crystalline Silicon PV Cells

Mitsubishi Announces 18.9% Conversion Efficiency Rate For Multi-Crystalline Silicon PV Cells


News Feb 23, 2009 by Jeff Shepard
ST Introduces MDmesh™ V Power-MOSFET Technology

ST Introduces MDmesh™ V Power-MOSFET Technology

Westcode Introduces New Water Cooled Heatsink For High Power Semiconductors

Westcode Introduces New Water Cooled Heatsink For High Power Semiconductors

Power Integrations Settles Patent Litigation With BCD Semiconductor

Power Integrations Settles Patent Litigation With BCD Semiconductor


News Feb 11, 2009 by Jeff Shepard
AMSC & DOE To Collaborate On 10 MW-Class Superconductor Wind Turbines

AMSC & DOE To Collaborate On 10 MW-Class Superconductor Wind Turbines


News Feb 09, 2009 by Jeff Shepard
STMicro Announces Silicon Carbide Schottky Diodes For Solar Power, Server Systems, & Motor Controllers

STMicro Announces Silicon Carbide Schottky Diodes For Solar Power, Server Systems, & Motor Controllers

Ericsson and ST Complete Deal To Create Joint Venture For Semiconductors & Platforms In Mobile Applications

Ericsson and ST Complete Deal To Create Joint Venture For Semiconductors & Platforms In Mobile Applications


News Feb 02, 2009 by Jeff Shepard
Fraunhofer Announces 41.1% Efficiency Multi-Junction Solar Cells

Fraunhofer Announces 41.1% Efficiency Multi-Junction Solar Cells


News Jan 28, 2009 by Jeff Shepard
Sanyo Introduces Xenon Flash IGBT

Sanyo Introduces Xenon Flash IGBT

CPS Offers AlSiC-9 Baseplates For IGBT Power Modules

CPS Offers AlSiC-9 Baseplates For IGBT Power Modules

IR Files Lawsuit Against Former CEO, Alleges Theft Of Trade Secrets & Racketeering

IR Files Lawsuit Against Former CEO, Alleges Theft Of Trade Secrets & Racketeering


News Jan 21, 2009 by Jeff Shepard
Semiconductor Circuits Inc. Releases 50W Converters With 4:1 Input

Semiconductor Circuits Inc. Releases 50W Converters With 4:1 Input

Vishay TrenchFET® Power MOSFET In MICRO FOOT® Chipscale Package Features Backside Insulation

Vishay TrenchFET® Power MOSFET In MICRO FOOT® Chipscale Package Features Backside Insulation

Cree Licenses GaN Substrate Technology To Mitsubishi Chemical

Cree Licenses GaN Substrate Technology To Mitsubishi Chemical


News Jan 20, 2009 by Jeff Shepard