Littelfuse, Inc. introduces a series of TVS Diode Arrays (SPA® Diodes) designed as a protection for electronic equipment pins from ESD or EFT
Littelfuse, Inc. introduces a series of TVS Diode Arrays (SPA® Diodes) designed as a protection for electronic equipment pins from ESD or EFT
IR HiRel, an Infineon Technologies AG company, has launched its first radiation hardened MOSFETs based on the proprietary…
IR HiRel, an Infineon Technologies AG company, has launched its first radiation hardened MOSFETs based on the proprietary N-channel R9 technology…
This article highlights Advanced Packaging Center and Alpha Assembly Solutions Silver (Ag) sintering proven and reliable…
This article highlights Advanced Packaging Center and Alpha Assembly Solutions Silver (Ag) sintering proven and reliable bonding technology for…
Wolfspeed expands its innovative C3M™ platform by introducing a 1200V, 75mΩ MOSFET in low-inductance discrete packaging
Wolfspeed expands its innovative C3M™ platform by introducing a 1200V, 75mΩ MOSFET in low-inductance discrete packaging
> <p>This article highlights ROHM about the potential structures of SiC devices, focusing on different structures and…
> <p>This article highlights ROHM about the potential structures of SiC devices, focusing on different structures and showing that…
This article describes the basic points of the X-Series design including the improvements contributing to a safe…
This article describes the basic points of the X-Series design including the improvements contributing to a safe operation of the device.
This article discusses the new standard dual-module package specially developed for High Voltage IGBTs HVIGBTs used in…
This article discusses the new standard dual-module package specially developed for High Voltage IGBTs HVIGBTs used in railway applications.
This article describes the challenges of inverter-based induction cooking and introduces a new technology that meets the…
This article describes the challenges of inverter-based induction cooking and introduces a new technology that meets the technical and price…
This article discusses the application of technologies of low-temperature sintering of silicon wafers and molybdenum…
This article discusses the application of technologies of low-temperature sintering of silicon wafers and molybdenum discs using the silver…
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