Littelfuse, Inc., the global leader in circuit protection, today introduced the first encapsulated surface mount fuse designed for intrinsic safety…
Littelfuse, Inc., the global leader in circuit protection, today introduced the first encapsulated surface mount fuse designed for intrinsic safety…
Alpha and Omega Semiconductor Limited announced the release of AOC3860, a common-drain 12V dual n-channel MOSFET with the…
Alpha and Omega Semiconductor Limited announced the release of AOC3860, a common-drain 12V dual n-channel MOSFET with the lowest on-resistance in…
This article highlights GaN Systems Inc. comparison of GaN E-HEMTs and SiC MOSFET performance and characteristics in…
This article highlights GaN Systems Inc. comparison of GaN E-HEMTs and SiC MOSFET performance and characteristics in power switching applications.
AVX Corporation, a leading manufacturer and supplier of passive components and interconnect solutions, is showcasing its…
AVX Corporation, a leading manufacturer and supplier of passive components and interconnect solutions, is showcasing its vast portfolio of…
This article discusses the advantages and benefits of applying Infineon's SiC MOSFETs with blocking voltages of 1200V in…
This article discusses the advantages and benefits of applying Infineon's SiC MOSFETs with blocking voltages of 1200V in various application…
Danfoss Silicon Power is establishing production in the US and entering into a collaboration with industrial giant…
Danfoss Silicon Power is establishing production in the US and entering into a collaboration with industrial giant General Electric (GE)
This article highlights Wolfspeed C3M™ SiC MOSFETs that considers package inductance and printed circuit board layout…
This article highlights Wolfspeed C3M™ SiC MOSFETs that considers package inductance and printed circuit board layout as factors for best system…
This article features a novel technique to redue substrate tilt and improve bondline control between AIN substrate and…
This article features a novel technique to redue substrate tilt and improve bondline control between AIN substrate and AlSiC Baseplate in IGBT…
This article provides insight into the latest generation of 6.5kV HiPak modules with reliable performance demonstrated in…
This article provides insight into the latest generation of 6.5kV HiPak modules with reliable performance demonstrated in the new THB-HVDC test.
This article discusses a flexible approach to gate drive designs using nHPD2 package from Hitachi targeted at traction…
This article discusses a flexible approach to gate drive designs using nHPD2 package from Hitachi targeted at traction applications.
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