This article discusses the method of increasing packing density of power electronics using Chip-on-Heatsink Technology for better thermal management.
This article discusses the method of increasing packing density of power electronics using Chip-on-Heatsink Technology for better thermal management.
The jury has decided to give the SEMIKRON Innovation Award 2016 to a researcher team from Erlangen for its innovation on…
The jury has decided to give the SEMIKRON Innovation Award 2016 to a researcher team from Erlangen for its innovation on 'Zero Tolerance -…
Knowles brand, Dielectric Laboratories (DLI), has announced a number of specification extensions to their Ultra-low ESR…
Knowles brand, Dielectric Laboratories (DLI), has announced a number of specification extensions to their Ultra-low ESR and High Q MLCC.
IXYS Integrated Circuits Division (ICD), Inc., a wholly owned subsidiary of IXYS Corporation (NASDAQ: IXYS), announced…
IXYS Integrated Circuits Division (ICD), Inc., a wholly owned subsidiary of IXYS Corporation (NASDAQ: IXYS), announced the immediate availability…
This article discusses Renesas Electronics' availability of six new products in the 8th-generation G8H Series of…
This article discusses Renesas Electronics' availability of six new products in the 8th-generation G8H Series of insulated gate bipolar…
Allegro MicroSystems Europe has introduced a new family of full-bridge gate-driver ICs designed to drive a wide range of…
Allegro MicroSystems Europe has introduced a new family of full-bridge gate-driver ICs designed to drive a wide range of DC brushed motors
This article introduces SPCO's Innova Macroprocessor, a solid-state, scalable power module sourcing optical signals to…
This article introduces SPCO's Innova Macroprocessor, a solid-state, scalable power module sourcing optical signals to trigger control circuits.
This article introduces Mitsubishi Electric Corporation's new three-level topology power modules with optimized packaging…
This article introduces Mitsubishi Electric Corporation's new three-level topology power modules with optimized packaging for 3-level inverter…
This article introduces DuPont Teijin Films' Teonex, a new dielectric for DC-Link and snubber power capacitors and…
This article introduces DuPont Teijin Films' Teonex, a new dielectric for DC-Link and snubber power capacitors and discusses its features and…
Magna-Power Electronics released its MagnaLOAD product line of DC electronic loads spanning 1.25 kW to 120 kW+
Magna-Power Electronics released its MagnaLOAD product line of DC electronic loads spanning 1.25 kW to 120 kW+
This article introduces Intersil Corporation's ISL78227 and ISL78229, two 55V two-phase synchronous boost controllers…
This article introduces Intersil Corporation's ISL78227 and ISL78229, two 55V two-phase synchronous boost controllers with integrated MOSFET…
Whenever we talk about Silicon Carbide and its applications, our thoughts jump to Silicon Carbide MOSFET power modules,…
Whenever we talk about Silicon Carbide and its applications, our thoughts jump to Silicon Carbide MOSFET power modules, the so called “Full…
This discusses the key events in Embedded World 2016 Exhibition & Conference in Nuremberg end February.
This discusses the key events in Embedded World 2016 Exhibition & Conference in Nuremberg end February.
Facebook
Google
GitHub
Linkedin