EEPower

Latest Gallium Nitride Articles

Categories

GaN Systems to Showcase Significant GaN Advancements at Leading Power Electronics Event in China

GaN Systems to Showcase Significant GaN Advancements at Leading Power Electronics Event in China

GaN Systems to Showcase Significant GaN Advancements at Leading Power Electronics Event in China.


new products Oct 28, 2019 by GaN Systems
Search for the Next Ltd and Semefab Introduce a New Transistor Wafer Process Technology

Search for the Next Ltd and Semefab Introduce a New Transistor Wafer Process Technology

Search For The Next’s technology uses quantum tunnel mechanics enabling complex ICs to be made competitively in existing…


IEDM to Feature Gallium-Nitride Power Semis & ICs and Thin-Film Solid State Batteries

IEDM to Feature Gallium-Nitride Power Semis & ICs and Thin-Film Solid State Batteries


News Oct 24, 2019 by Paul Shepard
Cree & NY CREATES Announce First SiC Wafer Demonstration at SUNY Poly

Cree & NY CREATES Announce First SiC Wafer Demonstration at SUNY Poly


News Oct 23, 2019 by Paul Shepard
High-Capacitance 63V and 80V Chip-Type Aluminum Electrolytic Capacitors

High-Capacitance 63V and 80V Chip-Type Aluminum Electrolytic Capacitors

Two-Phase, Direct-on-Chip, Liquid Cooling for Data Centers

Two-Phase, Direct-on-Chip, Liquid Cooling for Data Centers


News Oct 23, 2019 by Paul Shepard
Odyssey Semi Completes Strategic Acquisition of High-Voltage GaN Wafer Fab

Odyssey Semi Completes Strategic Acquisition of High-Voltage GaN Wafer Fab


News Oct 23, 2019 by Paul Shepard
Competing Integrated GaN and NonGaN Technologies in USB Wall Chargers

Competing Integrated GaN and NonGaN Technologies in USB Wall Chargers

GaN brings compelling advantages in terms of efficiency for wall chargers and other power supply products, but achieving these in a cost-effective…


Improving Efficiency with GaN + Multi-Objective Optimization & Nonlinear Control

Improving Efficiency with GaN + Multi-Objective Optimization & Nonlinear Control


News Oct 17, 2019 by Paul Shepard
Single-Chip ASIL-D-Compliant Battery Management IC for Mid-to-Large Cell Counts

Single-Chip ASIL-D-Compliant Battery Management IC for Mid-to-Large Cell Counts

Gallium-Nitride Enables World’s Smallest Adapter for World’s Fastest Laptop

Gallium-Nitride Enables World’s Smallest Adapter for World’s Fastest Laptop


News Oct 16, 2019 by Paul Shepard
64-Channel High-Voltage Switch IC from STMicroelectronics Drives Portability with Performance in Medical and Industrial Imaging

64-Channel High-Voltage Switch IC from STMicroelectronics Drives Portability with Performance in Medical and Industrial Imaging

This article features STMicroelectronics STHV64SW 64-channel high-voltage analog-switch IC with unprecedented integration for advanced ultrasound…


Alpha and Omega Semiconductor Introduces Ultra-Low Clamping Voltage High-Surge TVS

Alpha and Omega Semiconductor Introduces Ultra-Low Clamping Voltage High-Surge TVS

This article highlights Alpha and Omega Semiconductor  AOZ8621UNI Transient Voltage Suppressor (TVS) for VBUS protection with high-surge TVS…


EMC Filters for GaN- and SiC-Based Power Converters

EMC Filters for GaN- and SiC-Based Power Converters

64-Channel High-Voltage Switch IC for Medical and Industrial Imaging

64-Channel High-Voltage Switch IC for Medical and Industrial Imaging

AEC Q101 GaN FET Helps Time-of-Flight Lidar Systems ‘See’ Better

AEC Q101 GaN FET Helps Time-of-Flight Lidar Systems ‘See’ Better

1-kW, 80 Plus Titanium, GaN + Silicon Digital AC-DC Power Supply Reference Design

1-kW, 80 Plus Titanium, GaN + Silicon Digital AC-DC Power Supply Reference Design


News Oct 15, 2019 by Paul Shepard
Industry-First Energy Harvesting Power Management Chip for Biometric Payment Devices

Industry-First Energy Harvesting Power Management Chip for Biometric Payment Devices

GaN Totem-Pole PFC Design Guide and Power Loss Modeling

GaN Totem-Pole PFC Design Guide and Power Loss Modeling


News Oct 11, 2019 by Paul Shepard
Samsung Electronics Develops Industry’s First 12-Layer 3D-TSV Chip Packaging

Samsung Electronics Develops Industry’s First 12-Layer 3D-TSV Chip Packaging


News Oct 10, 2019 by Paul Shepard