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GaN Transistor Thermal RC Models Enhance SPICE Simulations

GaN Transistor Thermal RC Models Enhance SPICE Simulations

new products Feb 02, 2017 by Jeff Shepard
EU CHALLENGE Project Seeks 3C-SiC Devices for EVs

EU CHALLENGE Project Seeks 3C-SiC Devices for EVs

News Jan 31, 2017 by Jeff Shepard
650V and 1200V SiC Schottkys for Multi-kW Designs

650V and 1200V SiC Schottkys for Multi-kW Designs

new products Jan 31, 2017 by Power Pulse1595211359
Wireless Power Transmit IC Sends Power Over Distance

Wireless Power Transmit IC Sends Power Over Distance

News Jan 29, 2017 by Jeff Shepard
Himax Q4 2016 Financials Suffer from Inventory Write-Downs

Himax Q4 2016 Financials Suffer from Inventory Write-Downs

News Jan 29, 2017 by Jeff Shepard
EPC Adds Dr. Suvankar Biswas, Opens Blacksburg Apps Center

EPC Adds Dr. Suvankar Biswas, Opens Blacksburg Apps Center

News Jan 25, 2017 by Jeff Shepard
The Creation of Silicon Carbide Revolutionary Semiconductor

The Creation of Silicon Carbide Revolutionary Semiconductor

This article highlights SiCrystal AG and Rohm Semiconductor GmbH for the potential of Silicon Carbide material for power and RF electronics…

Technical Articles Jan 25, 2017 by Robert Eckstein
Power Management IC Targets DDR4 NVDIMMs

Power Management IC Targets DDR4 NVDIMMs

new products Jan 24, 2017 by Jeff Shepard
Silicon Labs Acquires Wi-Fi Innovator Zentri

Silicon Labs Acquires Wi-Fi Innovator Zentri

News Jan 23, 2017 by Jeff Shepard
Third-Generation Super Junction Devices from Hua Hong

Third-Generation Super Junction Devices from Hua Hong

News Jan 23, 2017 by Jeff Shepard
I3C Interface Specification from MIPI Supersets I2C

I3C Interface Specification from MIPI Supersets I2C

News Jan 19, 2017 by Jeff Shepard
Innovative Glass Substrates for Semiconductor Packaging

Innovative Glass Substrates for Semiconductor Packaging

News Jan 19, 2017 by Jeff Shepard
1608mm Size Metal Alloy Chip Inductor

1608mm Size Metal Alloy Chip Inductor

new products Jan 19, 2017 by Jeff Shepard
Mouser Signs Global Agreement with United Silicon Carbide

Mouser Signs Global Agreement with United Silicon Carbide

News Jan 18, 2017 by Jeff Shepard
GaN Produces 5nS Pulses for High-Performance LiDAR

GaN Produces 5nS Pulses for High-Performance LiDAR

News Jan 18, 2017 by Jeff Shepard
Precision Thin-Film Tantalum Nitride Chip Resistors

Precision Thin-Film Tantalum Nitride Chip Resistors

new products Jan 18, 2017 by Jeff Shepard
Low-Voltage Bipolar Stepper or Dual DC Motor Driver IC

Low-Voltage Bipolar Stepper or Dual DC Motor Driver IC

new products Jan 18, 2017 by Jeff Shepard
MiniSKiiP: The Power Density Master for Motor Drives

MiniSKiiP: The Power Density Master for Motor Drives

This article features the MiniSKiip series as the power density master for compact motor drives in reducing cost by maximizing output power density.

Technical Articles Jan 18, 2017 by Stefan Hopfe
0.35-micron 700V Technology with Simplified Process Flow

0.35-micron 700V Technology with Simplified Process Flow

News Jan 16, 2017 by Jeff Shepard
AirFuel Alliance Adds GaN Systems

AirFuel Alliance Adds GaN Systems

News Jan 15, 2017 by Jeff Shepard