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8A SiC MOSFET Gate Driver Supports Inverters of Several Hundred kW

8A SiC MOSFET Gate Driver Supports Inverters of Several Hundred kW

EPC Publishes 10th Reliability Report Highlighting GaN Device Testing Beyond AEC-Q101

EPC Publishes 10th Reliability Report Highlighting GaN Device Testing Beyond AEC-Q101


News Feb 26, 2019 by Paul Shepard
Dynamic Characterization Platform for SiC Power MOSFETs and Schottky Diodes

Dynamic Characterization Platform for SiC Power MOSFETs and Schottky Diodes

Xilinx and Infineon Collaborate on Power Solutions for the Zynq UltraScale  MPSoC and RFSoC Families

Xilinx and Infineon Collaborate on Power Solutions for the Zynq UltraScale MPSoC and RFSoC Families

Xilinx Inc. and Infineon Technologies AG are jointly providing scalable power supplies for the Xilinx® Zynq® UltraScale™ + MPSoC and RFSoC…


Single-Chip Wireless IoT Solution Improves Battery Life by Over 50%

Single-Chip Wireless IoT Solution Improves Battery Life by Over 50%

MACOM and STMicro Expand GaN-on-Si Capacity for 5G Rollout

MACOM and STMicro Expand GaN-on-Si Capacity for 5G Rollout


News Feb 25, 2019 by Scott McMahan
GE Research Awarded $3 Million to Develop High-Voltage SiC Super Junction MOSFET

GE Research Awarded $3 Million to Develop High-Voltage SiC Super Junction MOSFET


News Feb 23, 2019 by Scott McMahan
Denso, Sonnen, and Supermicro Join GaN Systems Presenting at APEC 2019

Denso, Sonnen, and Supermicro Join GaN Systems Presenting at APEC 2019


News Feb 22, 2019 by Scott McMahan
Gallium Oxide Could Have Lower Cost than SiC, NREL Analysis Reveals

Gallium Oxide Could Have Lower Cost than SiC, NREL Analysis Reveals


News Feb 21, 2019 by Paul Shepard
ASIL-D Real-Time Automotive MCUs with 40MB of On-Chip Memory

ASIL-D Real-Time Automotive MCUs with 40MB of On-Chip Memory

Vishay to Showcase New Products at APEC 2019

Vishay to Showcase New Products at APEC 2019


News Feb 21, 2019 by Scott McMahan
Heraeus and Toshiba Join Forces for the Development and Production of Silicon Nitride Ceramic Substrates Used in Hybrid and Electric Vehicles

Heraeus and Toshiba Join Forces for the Development and Production of Silicon Nitride Ceramic Substrates Used in Hybrid and Electric Vehicles

Heraeus Electronics, a leading provider of material solutions for the semiconductor industry and electronic packaging industry and Toshiba…


ROHM Announces New HighReliability 1608Size White Chip LED

ROHM Announces New HighReliability 1608Size White Chip LED

ROHM today announced the availability of the SMLD12WBN1W, a White chip LED with 1608 (1.6x0.8mm) size that achieves class-leading reliability. This…


new products Feb 21, 2019 by ROHM
H-Bridge Driver IC with Integrated Arm Cortex M0 for Automotive

H-Bridge Driver IC with Integrated Arm Cortex M0 for Automotive

Terahertz Wireless Makes Big Strides in Paving the Way to Technological Singularity

Terahertz Wireless Makes Big Strides in Paving the Way to Technological Singularity


News Feb 20, 2019 by Paul Shepard
Switching Performance of 750A/3300V Dual SiC-Modules

Switching Performance of 750A/3300V Dual SiC-Modules

This article focuses on the switching behavior of SiC devices and compares Full SiC and Hybrid SiC with the behavior of a silicon device.


Trench Schottky Rectifier Functioning Benefits and Use Cases

Trench Schottky Rectifier Functioning Benefits and Use Cases

This article is mainly discussing the functioning and the benefits of Trench Schottky rectifiers.


MagnaChip Offers 0.13-Micron/18V Process for LCD and OLED TV Drivers

MagnaChip Offers 0.13-Micron/18V Process for LCD and OLED TV Drivers


News Feb 18, 2019 by Scott McMahan
60V/100A N-Channel MOSFET with 1.7mΩ On-Resistance

60V/100A N-Channel MOSFET with 1.7mΩ On-Resistance

Latest Generation IGBT Modules for Efficient, Reliable & Power Dense Systems

Latest Generation IGBT Modules for Efficient, Reliable & Power Dense Systems

This article discusses Dynex' new generation of high-power IGBT modules, covering a 3.3kV to 6.5kV voltage range.