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KEMET’s Engineering Center Bringing Interactive Competition to APEC 2019

KEMET’s Engineering Center Bringing Interactive Competition to APEC 2019

News Mar 04, 2019 by Scott McMahan
Automotive SiC MOSFETs in LowInductive SMD Package with Kelvin Source

Automotive SiC MOSFETs in LowInductive SMD Package with Kelvin Source

This article discusses the performance benefits arising from the use of a low-inductive SMD package with a Kelvin-Source pin for fast SiC MOSFETs.

Technical Articles Mar 04, 2019 by Christian Felgemacher
ON Semiconductor Opens Bangalore Facility to Integrate Operations in India

ON Semiconductor Opens Bangalore Facility to Integrate Operations in India

News Mar 03, 2019 by Scott McMahan
40V Three-Phase Sensorless Sinusoidal Fan Driver IC Minimizes Vibration & Noise

40V Three-Phase Sensorless Sinusoidal Fan Driver IC Minimizes Vibration & Noise

new products Mar 01, 2019 by Scott McMahan
Hans Keller joins Höganäs as new President for Product Area Surface and Joining Technologies

Hans Keller joins Höganäs as new President for Product Area Surface and Joining Technologies

Hans Keller joins Höganäs as President Product Area Surface & Joining Technologies on 1 March 2019.

new products Mar 01, 2019 by Hoganas
New SCALE-iDriver SiC-MOSFET Gate Driver from Power Integrations Maximizes Efficiency Improves Safety

New SCALE-iDriver SiC-MOSFET Gate Driver from Power Integrations Maximizes Efficiency Improves Safety

Power Integrations, the leader in gate-driver technology for medium- and high-voltage inverter applications, today announced the SIC1182K…

new products Mar 01, 2019 by Power Integrations
JEDEC Wide Bandgap Power Semiconductor Committee Publishes First Document Test Method for Dynamic Resistance of GaN HEMT

JEDEC Wide Bandgap Power Semiconductor Committee Publishes First Document Test Method for Dynamic Resistance of GaN HEMT

 JEDEC announces the publication of JEP173: Dynamic On-Resistance Test Method Guidelines for GaN HEMT Based Power Conversion Devices

new products Mar 01, 2019 by JEDEC
Power Module Substrate Options Available to Lower Semiconductor Junction Temperatures for Increased Reliability

Power Module Substrate Options Available to Lower Semiconductor Junction Temperatures for Increased Reliability

This article examines changing a power module's substrate as a possible option for lowering its semiconductors junction temperatures without…

Technical Articles Mar 01, 2019 by Jerry Moudilos
Infineon to Showcase Array of Power Management Solutions at APEC

Infineon to Showcase Array of Power Management Solutions at APEC

News Feb 28, 2019 by Paul Shepard
14mm PD GaN Charger at MWC Barcelona 2019

14mm PD GaN Charger at MWC Barcelona 2019

News Feb 28, 2019 by Paul Shepard
Transphorm’s Gen III GaN Platform Earns Automotive Qualification

Transphorm’s Gen III GaN Platform Earns Automotive Qualification

News Feb 28, 2019 by Paul Shepard
8A SiC MOSFET Gate Driver Supports Inverters of Several Hundred kW

8A SiC MOSFET Gate Driver Supports Inverters of Several Hundred kW

new products Feb 26, 2019 by Scott McMahan
EPC Publishes 10th Reliability Report Highlighting GaN Device Testing Beyond AEC-Q101

EPC Publishes 10th Reliability Report Highlighting GaN Device Testing Beyond AEC-Q101

News Feb 26, 2019 by Paul Shepard
Dynamic Characterization Platform for SiC Power MOSFETs and Schottky Diodes

Dynamic Characterization Platform for SiC Power MOSFETs and Schottky Diodes

new products Feb 26, 2019 by Paul Shepard
Xilinx and Infineon Collaborate on Power Solutions for the Zynq UltraScale MPSoC and RFSoC Families

Xilinx and Infineon Collaborate on Power Solutions for the Zynq UltraScale MPSoC and RFSoC Families

Xilinx Inc. and Infineon Technologies AG are jointly providing scalable power supplies for the Xilinx® Zynq® UltraScale™ + MPSoC and RFSoC…

new products Feb 26, 2019 by Infineon Technologies
Single-Chip Wireless IoT Solution Improves Battery Life by Over 50%

Single-Chip Wireless IoT Solution Improves Battery Life by Over 50%

new products Feb 25, 2019 by Scott McMahan
MACOM and STMicro Expand GaN-on-Si Capacity for 5G Rollout

MACOM and STMicro Expand GaN-on-Si Capacity for 5G Rollout

News Feb 25, 2019 by Scott McMahan
GE Research Awarded $3 Million to Develop High-Voltage SiC Super Junction MOSFET

GE Research Awarded $3 Million to Develop High-Voltage SiC Super Junction MOSFET

News Feb 23, 2019 by Scott McMahan
Denso, Sonnen, and Supermicro Join GaN Systems Presenting at APEC 2019

Denso, Sonnen, and Supermicro Join GaN Systems Presenting at APEC 2019

News Feb 22, 2019 by Scott McMahan
Gallium Oxide Could Have Lower Cost than SiC, NREL Analysis Reveals

Gallium Oxide Could Have Lower Cost than SiC, NREL Analysis Reveals

News Feb 21, 2019 by Paul Shepard