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Bonding Ribbon for the Next Generation of Power Electronics

Bonding Ribbon for the Next Generation of Power Electronics

he product enables power modules to be designed and manufactured more reliably, efficiently, and cost-effectively.


News Sep 14, 2020 by Hailey Stewart
ON Semi to Sell Japanese Power Fabs

ON Semi to Sell Japanese Power Fabs

Power device giant ON Semiconductor seeks to sell two wafer fabs in Niigata, Japan.


News Sep 13, 2020 by Shannon Cuthrell
Allegro MicroSystems Acquires Voxtel to Expand Development of LiDAR Technologies

Allegro MicroSystems Acquires Voxtel to Expand Development of LiDAR Technologies

Allegro MicroSystems joined forces with Voxtel to initiate innovative advanced driver assistance systems for vehicles of the future.


News Sep 12, 2020 by Stephanie Leonida
Researchers Find Graphene Ribbons Mimic Semiconductor Materials

Researchers Find Graphene Ribbons Mimic Semiconductor Materials

Physicists and chemists from the Swedish Universities of Basel and Bern have produced the first porous graphene ribbons in which specific carbon…


Maxim Integrated Introduces a Mobile App for Analog IC Information

Maxim Integrated Introduces a Mobile App for Analog IC Information

Maxim Integrated releases a new app that provides systems engineers with a large repository of resources centered around its range of…


News Sep 09, 2020 by Stephanie Leonida
Designing a Double-Pulse Test System to Enable Correlation of Dynamic Characteristics

Designing a Double-Pulse Test System to Enable Correlation of Dynamic Characteristics

This article discusses important considerations when designing a standard DPT system used to correlate results between multiple test systems.


Microchip Introduces AgileSwitch Digital Programmable Gate Driver and SP6LI SiC Power Module

Microchip Introduces AgileSwitch Digital Programmable Gate Driver and SP6LI SiC Power Module

Microchip’s AgileSwitch® digital programmable gate driver and SP6LI SiC power module kit solution enables developers to proceed quickly from…


Energous And Dialog Semiconductor’s New Wireless Charging Module Provides Speed for an Array of Applications

Energous And Dialog Semiconductor’s New Wireless Charging Module Provides Speed for an Array of Applications

Energous Corporation announced a new module that integrates components provided by Dialog Semiconductor in a strategic partnership to create a…


Fraunhofer Embeds GaN Power ICs on Single Chip

Fraunhofer Embeds GaN Power ICs on Single Chip

Researchers at the Fraunhofer-Institute for Applied Solid State Physics IAF have incorporated their patented Gallium-Nitride (GaN) power ICs, DC-DC…


Easy Start with CoolSiC MOSFET Technology in Drives Applications

Easy Start with CoolSiC MOSFET Technology in Drives Applications

The evaluation board integrates a 3-phase rectifier EMI filter, current sensors, and protection features as well as thermal management and heatsink.


Compact Active Clamp Flyback Design

Compact Active Clamp Flyback Design

Taiwan Semiconductor Unveils Drop-in Replacements for Legacy Bipolar Drivers

Taiwan Semiconductor Unveils Drop-in Replacements for Legacy Bipolar Drivers

These new constant-current CMOS LED driver ICs enable upgrades of existing designs for higher performance while requiring no redesign effort.


News Sep 02, 2020 by Gary Elinoff
Mitsubishi Electric to Launch LV100-type T-series IGBT Module for Industrial Use

Mitsubishi Electric to Launch LV100-type T-series IGBT Module for Industrial Use

Mitsubishi Electric Corporation announced the launch of its LV100-type T-series insulated-gate bipolar transistor (IGBT) module for industrial uses.


Dialog Semiconductor Strengthens Relationship With Renesas by Powering Auto Platforms For Future Autonomous Vehicles

Dialog Semiconductor Strengthens Relationship With Renesas by Powering Auto Platforms For Future Autonomous Vehicles

Dialog Semiconductor has been designing automotive power management IC (PMIC) solutions for Renesas Electronics’ R-Car family that are…


Electronics Companies Share Quarterly Financial Results

Electronics Companies Share Quarterly Financial Results

Power electronics companies give insight into the impact of COVID-19 in their second and third-quarter earnings results.


News Aug 30, 2020 by Shannon Cuthrell
II-VI Incorporated to Acquire Ascatron and INNOViON’s Outstanding Interests to Build SiC Platform

II-VI Incorporated to Acquire Ascatron and INNOViON’s Outstanding Interests to Build SiC Platform

II-VI Incorporated will expand its silicon carbide capabilities by leveraging expertise from Ascatron and INNOViON in upcoming acquisitions later…


News Aug 29, 2020 by Stephanie Leonida
Delphi Technologies’ Newest EV-Based Products Initiate Industry Expansion

Delphi Technologies’ Newest EV-Based Products Initiate Industry Expansion

Delphi Technologies initiates market expansion of electric vehicle technologies through winning new business with Chinese Original Equipment…


News Aug 28, 2020 by Stephanie Leonida
New Tantalum Polymer Capacitors, Super Capacitors and Aluminum Capacitors

New Tantalum Polymer Capacitors, Super Capacitors and Aluminum Capacitors

In this month’s capacitor product recap we take a look at transistors from Kemet, Vishay, and Cornell Dubilier.


EPC introduces two new 200 Volt eGaN Power FETs

EPC introduces two new 200 Volt eGaN Power FETs

The EPC2215 and EPC2207 sport typical RDS(ON) ’s of 6 mΩ and 22 mΩ, respectively


Silicon Germanium Rectifiers Provide High Efficiency, Thermal Stability

Silicon Germanium Rectifiers Provide High Efficiency, Thermal Stability

AEC-Q101 approved devices with 120V, 150V, and 200V combine best attributes of Schottky and fast recovery diodes