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Single-Chip PLC Modem supports All Protocol Standards

Single-Chip PLC Modem supports All Protocol Standards

InFORMS vs the Trimmed  Wirebond Technique to Achieve Uniform Bondline Control Between Substrate and Baseplate

InFORMS vs the Trimmed Wirebond Technique to Achieve Uniform Bondline Control Between Substrate and Baseplate

This article discusses TT Electronics and Hybrid testing the inFORMS and discusses the reliability of this interconnect increases in thermal cycles.


Flexible Low-Cost Level 2 EV Charger

Flexible Low-Cost Level 2 EV Charger

1-W Surface-Mount Medical DC-DCs

1-W Surface-Mount Medical DC-DCs

Efficient Inverters for PV Systems

Efficient Inverters for PV Systems

This article highlights Zeversolar that is a chinese manufacturer of PV inverters in the budget segment, making the solar energy available to…


Harwin Breaks Ground on UK Manufacturing Facility

Harwin Breaks Ground on UK Manufacturing Facility


News Oct 19, 2015 by Jeff Shepard
1500V Super-Junction Power MOSFETs

1500V Super-Junction Power MOSFETs

FETs Balance Supercaps in Industrial Applications

FETs Balance Supercaps in Industrial Applications

All-in-one Multifunctional Transient Test Generator

All-in-one Multifunctional Transient Test Generator

Compact 1200 V1700 V SCALE2 Dual-Driver-Core Family with More Protection Features

Compact 1200 V1700 V SCALE2 Dual-Driver-Core Family with More Protection Features

Power Integrations, the leader in IGBT-driver technology, launched its latest SCALE™-2+ dual IGBT-driver core, the 2SC0435T2G1-17


China seeks to accelerate More-than-Moore in Silicon Valley

China seeks to accelerate More-than-Moore in Silicon Valley


News Oct 18, 2015 by Jeff Shepard
Stadium Power moves Power Supply Distribution to Stontronics

Stadium Power moves Power Supply Distribution to Stontronics


News Oct 18, 2015 by Jeff Shepard
Semcon and PowerCell partner on Fuel Cell Production

Semcon and PowerCell partner on Fuel Cell Production


News Oct 15, 2015 by Jeff Shepard
Isolated Base Modules Rated from 1400V to 3600V

Isolated Base Modules Rated from 1400V to 3600V

Fairchild Streamlines Operations to Lower Breakeven

Fairchild Streamlines Operations to Lower Breakeven


News Oct 14, 2015 by Jeff Shepard
24M and NEC Collaborating on Next-gen Energy Storage

24M and NEC Collaborating on Next-gen Energy Storage


News Oct 13, 2015 by Jeff Shepard
320W to 600W High-Density Chassis-Mount DC-DCs

320W to 600W High-Density Chassis-Mount DC-DCs

Integrated Platform accelerates IoT and Embedded Designs

Integrated Platform accelerates IoT and Embedded Designs


News Oct 12, 2015 by Jeff Shepard
Convection-cooled 200- to 400W Industrial Power

Convection-cooled 200- to 400W Industrial Power

Enhanced Module Design Makes Most of New IGBT5 Performance

Enhanced Module Design Makes Most of New IGBT5 Performance

This article highlights Infineon Technologies AG PrimePACK 3+ package that extends the current range of the PrimePACK series to 1800 A with .XT…