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Lever Actuated Spring Pin Socket for NXP’s MCU

Lever Actuated Spring Pin Socket for NXP’s MCU

Ironwood Electronics recently introduced a new BGA socket addressing high-performance requirements for Microcontroller Unit CBT-BGA-6075. The…


Maxim’s Himalaya uSLIC Solution Revolutionizes Design for Highly Space-Constrained Applications

Maxim’s Himalaya uSLIC Solution Revolutionizes Design for Highly Space-Constrained Applications

Designers working on space-constrained applications can now dramatically reduce solution size and increase efficiency with the family of micro…


400V Linear Regulators from Diodes Incorporated Deliver Constant LED Current in Compact Packages

400V Linear Regulators from Diodes Incorporated Deliver Constant LED Current in Compact Packages

Diodes Incorporated announced the introduction of the AL5890 linear constant-current regulator developed to provide simple and more cost-effective…


High-Temperature SCR Switching Thyristors Rated to 600V & 40A

High-Temperature SCR Switching Thyristors Rated to 600V & 40A

Silicon Nitride Substrates for Improved Performance in Power Electronics

Silicon Nitride Substrates for Improved Performance in Power Electronics

This article discusses the comparison between silicon nitride substrates and other materials and offers insights of Silicon Nitride Substrates.


Silicon Designs Announces Enhanced Bias and Scale Factor Over Temperature Performance for Model 2220 Series

Silicon Designs Announces Enhanced Bias and Scale Factor Over Temperature Performance for Model 2220 Series

Silicon Designs announces the recently enhanced performance of its compact, low-mass, single-axis Model 2220 series.


Three-Phase Brushless Fan Motor Driver IC Has a Rotation Speed Control

Three-Phase Brushless Fan Motor Driver IC Has a Rotation Speed Control

Thermistor Eliminates Conduction between Leads for Highest Temperature-Sensing Accuracy

Thermistor Eliminates Conduction between Leads for Highest Temperature-Sensing Accuracy

Fast Curing Thermally Conductive Epoxy Adhesive

Fast Curing Thermally Conductive Epoxy Adhesive

A new fast curing Aluminum Filled Epoxy Adhesive (70-3814) was developed by Epoxies, Etc. 


new products Apr 02, 2018 by Epoxies Etc
Wide Band Gap is No Mystery

Wide Band Gap is No Mystery

This article highlights Siemens AG GaN power semiconductors technology in the power electronics system design that work at higher switching…


DCM 1000 Designed to Meet the Future Demand of Electric Vehicle Drive Train

DCM 1000 Designed to Meet the Future Demand of Electric Vehicle Drive Train

The acceleration of global warming and pollution, as well as international carbon emission targets, initiated a process to reduce emissions in all…


ONE Design Equation for Custom Inductors An Introduction to Power Electronics

ONE Design Equation for Custom Inductors An Introduction to Power Electronics

Over 35 years ago, I started my career in power electronics. I completed a practical power project in my senior year in college, building a 6KV, 20kHz


Full SiC Performance in Power Modules

Full SiC Performance in Power Modules

This article highlights Semikron silicon carbide performance in power modules especially SEMITRANS 3 module and SEMITOP E2 baseplate-less module.


Cool Running, 144W, 4 × 40A μModule POL Regulator

Cool Running, 144W, 4 × 40A μModule POL Regulator

The LTM®4636 is a 40A-capable μModule® regulator featuring 3D packaging technology, or component-on-package (CoP) to keep it cool. In addition…


High-temperature Dielectric Film Grades for Capacitors

High-temperature Dielectric Film Grades for Capacitors

High-end IEC Power Entry Modules now Meet IEC IEC62368-1

High-end IEC Power Entry Modules now Meet IEC IEC62368-1

A Low-Profile IPM with Optimized Heat Dissipation for Use in Restricted Environments CIPOS Nano IPM

A Low-Profile IPM with Optimized Heat Dissipation for Use in Restricted Environments CIPOS Nano IPM

This article introduces the Infineon's CIPOS Nano IPM that functions in space-constrained environments by dissipating heat via PCB.


Evaluating Fringing Effects in Multi-Gapped Toroids

Evaluating Fringing Effects in Multi-Gapped Toroids

This article highlights the importance of evaluating the fringing and thermal effects of multiple gaps in toroidal cores.


Liquid Cold Plates with Innovative Fin Design Perform 30% Better

Liquid Cold Plates with Innovative Fin Design Perform 30% Better

Metal Hybrid PPTC Mini-Breaker with Resettable Thermal Cut-Off Handles Higher Currents in a Smaller Package

Metal Hybrid PPTC Mini-Breaker with Resettable Thermal Cut-Off Handles Higher Currents in a Smaller Package

Littelfuse introduces the MHP-TAT18 Metal Hybrid PPTC Battery Mini-Breaker with resettable Thermal Cut-Off (TCO)


new products Jan 23, 2018 by Littelfuse