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MasterGaN Reference Design from STMicroelectronics Demonstrates Heatsink-Free 250W Resonant Converter

MasterGaN Reference Design from STMicroelectronics Demonstrates Heatsink-Free 250W Resonant Converter

This article highlights STMicroelectronics reference design for its MasterGaN power packages, demonstrating how the new highly integrated devices…


Minimizing Thermo-Mechanical Stress in Chipscale eGaN Devices

Minimizing Thermo-Mechanical Stress in Chipscale eGaN Devices

This article highlights EPC EPC2001C and EPC2053 temperature cycling results.


Heat as an Energy Source

Heat as an Energy Source

This series provides a look at different phenomena that can produce electrical energy. In this article, the sixth in our series, we’ll discuss…


TDK Offers Robust X2 Capacitors for High-temperature Requirements

TDK Offers Robust X2 Capacitors for High-temperature Requirements

This article highlights TDK series of EPCOS MKP-X2 capacitors for interference suppression.


A New Solid-State Material Could be Used in High-Temperature Thermal Diodes

A New Solid-State Material Could be Used in High-Temperature Thermal Diodes

Thermal management is a challenge throughout most, if not all, fields in engineering, on the macro, micro and nanoscopic scales. A research team…


News Apr 13, 2021 by Nicholas St. John
KULR and Andretti to Partner on Thermal Management Testing and Design Platform

KULR and Andretti to Partner on Thermal Management Testing and Design Platform

KULR and Andretti Autosport announced a long-term partnership to bring the same technology used in the Mars Rover to electric vehicle batteries and…


News Apr 02, 2021 by Shannon Cuthrell
SEMI-THERM Conference to Be Held Virtually March 22–26

SEMI-THERM Conference to Be Held Virtually March 22–26

The 37th annual SEMI-THERM conference and exhibition will take place virtually March 22–26. Here’s a preview of the event.


News Mar 21, 2021 by Shannon Cuthrell
Understanding Thermal Management of Chip-Scale GaN Devices

Understanding Thermal Management of Chip-Scale GaN Devices

This article discusses the challenges that thermal management raises due to increased power density, especially with chip-scale-packaging (CSP).


Understanding the Ferranti Effect in Transmission Lines

Understanding the Ferranti Effect in Transmission Lines

This article presents an overview of the Ferranti effect, describing the causes and consequences of the phenomenon and highlighting which main…


KULR Extends Thermal Management Design Services to Aerospace and Defense Manufacturer

KULR Extends Thermal Management Design Services to Aerospace and Defense Manufacturer

KULR provides its technological expertise in thermal management to a global Tier-1 aerospace and defense manufacturer for hypersonic weapon design.


News Jan 30, 2021 by Stephanie Leonida
Thermal Management Trends of 2020

Thermal Management Trends of 2020

The adoption of thermal management technologies continues to ramp up within the 5G and EV markets. Here’s a recap of the key trends dominating…


News Dec 16, 2020 by Shannon Cuthrell
University Researchers Identify Graphene-Based Pipes For Cooling Electronics and Power Systems

University Researchers Identify Graphene-Based Pipes For Cooling Electronics and Power Systems

Chalmers University Researchers and international collaborators discover the advantages of using graphene-enhanced heat pipes for cooling…


600W Medical and Industrial Power Supplies Offered with Integral Fan for Simplified Cooling

600W Medical and Industrial Power Supplies Offered with Integral Fan for Simplified Cooling

TDK Corporation announces the addition of models with an integral fan and enclosure to the 600W rated TDK-Lambda brand CUS600M series of AC-DC…


Volkswagen Chooses NXP for its MEB Electrical Vehicle Platform

Volkswagen Chooses NXP for its MEB Electrical Vehicle Platform

The Modular Electric Vehicle Platform, or MEB, will serve as the basis of entire families of electrified compact Cars, SUVs and Vans


News Oct 21, 2020 by Gary Elinoff
CUI Devices’ Thermal Management Group Expands its Peltier Module Product Line

CUI Devices’ Thermal Management Group Expands its Peltier Module Product Line

The new Micro Peltier Modules feature package sizes with dimensions from 3.4mm to 9.5mm with profiles as low as 1.95mm.


TDK’s 5 to 25W Board Mount Class II Power Supplies Showcase Wide Operating Temperature Ranges

TDK’s 5 to 25W Board Mount Class II Power Supplies Showcase Wide Operating Temperature Ranges

TDK Corporation features the introduction of the KPSB6 series of 5 to 6W and the KPSB25 series of 20 to 25W board mount AC-DC power supplies.


Tektronix’s Series of Mixed Signal Oscilloscopes Feature a 10 GHz Bandwidth and Handle up to 50 GS/S

Tektronix’s Series of Mixed Signal Oscilloscopes Feature a 10 GHz Bandwidth and Handle up to 50 GS/S

Tektronix’s mixed signal oscilloscopes are the first on the market to feature a greater than 2 GHz bandwidth while providing up to 8 input channels


Nexperia Introduces Four AEC-Q101 Qualified ESD Protection Devices to its TrEOS Line

Nexperia Introduces Four AEC-Q101 Qualified ESD Protection Devices to its TrEOS Line

The new units allow for high signal integrity and feature low clamping voltages along with high surge robustness.


An Overview of Energy Storage Systems and Their Applications

An Overview of Energy Storage Systems and Their Applications

This article will describe the main applications of energy storage systems and the benefits of each application.


Parker Hannifin Introduces THERM-A-GAPTM GEL 37

Parker Hannifin Introduces THERM-A-GAPTM GEL 37

This article highlights THERM-A-GAP GEL 37 as the next generation of single component, thermally conductive dispensable materials.