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Alpha and Omega Semiconductor (AOS) Debuts a New Series of Coil Drivers

Alpha and Omega Semiconductor (AOS) Debuts a New Series of Coil Drivers

The first series member is a highly integrated half-bridge device aimed at wireless charging applications.


Thermally Conductive Foil Used as Thermal Interface Material (TIM) in Power Electronics

Thermally Conductive Foil Used as Thermal Interface Material (TIM) in Power Electronics

The omnipresent trend in Power Electronics for higher performances at smaller space require a quick, effective and cost-efficient heat-transfer…


Henkel Develops Silicone-free Liquid Thermal Gap Filler with Excellent Dielectric Strength for High Voltage Applications

Henkel Develops Silicone-free Liquid Thermal Gap Filler with Excellent Dielectric Strength for High Voltage Applications

Henkel today announced the commercial launch of Bergquist Gap Filler TGF 3000SF, the latest in the company’s line of silicone-free thermal…


AVX Launches New TCO Series High-Temperature, Automotive-Grade Polymer Chip Capacitors

AVX Launches New TCO Series High-Temperature, Automotive-Grade Polymer Chip Capacitors

TCO Series capacitors meet AEC-Q200 requirements, exhibit low DCL and a benign failure mode, and are ideal for use in low- and medium-power…


Jasper Electronics Introduces High Efficiency Compact Convection Cooled Power Supply Series

Jasper Electronics Introduces High Efficiency Compact Convection Cooled Power Supply Series

Rated from 200W to 500W output power, the new GPAD Series convection cooled power supplies feature universal AC input (90 – 264VAC), power factor…


Transformer Core Design and Cooling Classes

Transformer Core Design and Cooling Classes

Two key transformer design parameters are the type of core and the type of cooling. Common types of cooling include dry and oil-immersed…


Schneider Electric Explores Liquid Cooled Data Centers

Schneider Electric Explores Liquid Cooled Data Centers

As thermal management is increasingly becoming a concern for design engineers, Schneider Electric has announced a new liquid-cooled, modular data…


Paragraf and Oxford Instruments Test Graphene-based Sensors Under Cryogenic Temperatures

Paragraf and Oxford Instruments Test Graphene-based Sensors Under Cryogenic Temperatures

Paragraf, a spin-out company from the Department of Materials Science and Metallurgy of Cambridge University, has released a new Hall Effect sensor…


MasterGaN Reference Design from STMicroelectronics Demonstrates Heatsink-Free 250W Resonant Converter

MasterGaN Reference Design from STMicroelectronics Demonstrates Heatsink-Free 250W Resonant Converter

This article highlights STMicroelectronics reference design for its MasterGaN power packages, demonstrating how the new highly integrated devices…


Minimizing Thermo-Mechanical Stress in Chipscale eGaN Devices

Minimizing Thermo-Mechanical Stress in Chipscale eGaN Devices

This article highlights EPC EPC2001C and EPC2053 temperature cycling results.


Heat as an Energy Source

Heat as an Energy Source

This series provides a look at different phenomena that can produce electrical energy. In this article, the sixth in our series, we’ll discuss…


TDK Offers Robust X2 Capacitors for High-temperature Requirements

TDK Offers Robust X2 Capacitors for High-temperature Requirements

This article highlights TDK series of EPCOS MKP-X2 capacitors for interference suppression.


A New Solid-State Material Could be Used in High-Temperature Thermal Diodes

A New Solid-State Material Could be Used in High-Temperature Thermal Diodes

Thermal management is a challenge throughout most, if not all, fields in engineering, on the macro, micro and nanoscopic scales. A research team…


News Apr 13, 2021 by Nicholas St. John
KULR and Andretti to Partner on Thermal Management Testing and Design Platform

KULR and Andretti to Partner on Thermal Management Testing and Design Platform

KULR and Andretti Autosport announced a long-term partnership to bring the same technology used in the Mars Rover to electric vehicle batteries and…


News Apr 02, 2021 by Shannon Cuthrell
SEMI-THERM Conference to Be Held Virtually March 22–26

SEMI-THERM Conference to Be Held Virtually March 22–26

The 37th annual SEMI-THERM conference and exhibition will take place virtually March 22–26. Here’s a preview of the event.


News Mar 21, 2021 by Shannon Cuthrell
Understanding Thermal Management of Chip-Scale GaN Devices

Understanding Thermal Management of Chip-Scale GaN Devices

This article discusses the challenges that thermal management raises due to increased power density, especially with chip-scale-packaging (CSP).


Understanding the Ferranti Effect in Transmission Lines

Understanding the Ferranti Effect in Transmission Lines

This article presents an overview of the Ferranti effect, describing the causes and consequences of the phenomenon and highlighting which main…


KULR Extends Thermal Management Design Services to Aerospace and Defense Manufacturer

KULR Extends Thermal Management Design Services to Aerospace and Defense Manufacturer

KULR provides its technological expertise in thermal management to a global Tier-1 aerospace and defense manufacturer for hypersonic weapon design.


News Jan 30, 2021 by Stephanie Leonida
Thermal Management Trends of 2020

Thermal Management Trends of 2020

The adoption of thermal management technologies continues to ramp up within the 5G and EV markets. Here’s a recap of the key trends dominating…


News Dec 16, 2020 by Shannon Cuthrell
University Researchers Identify Graphene-Based Pipes For Cooling Electronics and Power Systems

University Researchers Identify Graphene-Based Pipes For Cooling Electronics and Power Systems

Chalmers University Researchers and international collaborators discover the advantages of using graphene-enhanced heat pipes for cooling…