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Composite-Molded Surface-Mount Inductors for Lighting

Composite-Molded Surface-Mount Inductors for Lighting

Bel Power Solutions Announces SPSPFE3 Series 18kW Power Shelves Compatible with Open Compute Rack Designs

Bel Power Solutions Announces SPSPFE3 Series 18kW Power Shelves Compatible with Open Compute Rack Designs

Bel Power Solutions and Protection announces the SPSPFE3-05G and SPSPFE3-06G (PDF) power shelves.


Bel Power Solutions Announces ABH50 Series 50 W Open Frame Power Supply

Bel Power Solutions Announces ABH50 Series 50 W Open Frame Power Supply

Bel Power Solutions and Protection announces the ABH50 Series, a 50 W open frame power supply designed for cost-sensitive industrial applications.


AEC-Q200 150W Thick-Film Power Resistors in Clip-Mount TO247

AEC-Q200 150W Thick-Film Power Resistors in Clip-Mount TO247

MORNSUN Expands Rail R3 DC-DC converters up to 40W in 21 package

MORNSUN Expands Rail R3 DC-DC converters up to 40W in 21 package

MORNSUN recently launched a new Rail R3 DC/DC converters URF1D_LD-40WR3, as an extension of MORNSUN 6-20W rail R3 DC/DC converters.


new products Jul 30, 2018 by MORNSUN
Inevitability of Near Chip-Scale SMD Packaging for Power GaN and SiC

Inevitability of Near Chip-Scale SMD Packaging for Power GaN and SiC

This article is a Q&A aiming to provide insight into the benefits of WBG near chip-scale package capability and its ultimate form, the μMaxPak…


AVX Extends its Range of Space-Level ESCC QPL 3009041 X7R BME MLCCs with Two New Case Sizes

AVX Extends its Range of Space-Level ESCC QPL 3009041 X7R BME MLCCs with Two New Case Sizes

AVX Corporation has extended its range of space-level ESCC QPL 3009/041 X7R base metal electrode (BME) multilayer ceramic capacitors (MLCCs).


new products Jul 17, 2018 by AVX
Class 2 MLCC Dielectrics and the Case of the Missing Capacitance

Class 2 MLCC Dielectrics and the Case of the Missing Capacitance

This article discusses two different characteristics of the Multilayer Ceramic Chip Capacitors.


Metal Ceramic Substrate Optimized for Power Electronics

Metal Ceramic Substrate Optimized for Power Electronics

Power Electronics and Control Enclosure Platform for the Energy World

Power Electronics and Control Enclosure Platform for the Energy World


News May 23, 2018 by Paul Shepard
Flex Power Modules Announces New BGA Packaging Option for Digital Point-of-Load DC-DC Converters

Flex Power Modules Announces New BGA Packaging Option for Digital Point-of-Load DC-DC Converters

Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with…


Surface-Mount IPMs for Low-Cost Inverter Systems Coming to Market

Surface-Mount IPMs for Low-Cost Inverter Systems Coming to Market


News May 14, 2018 by Paul Shepard
TDK Acquires Faraday Semi to Bolster Power Solutions with, Si, GaN & 3D Packaging

TDK Acquires Faraday Semi to Bolster Power Solutions with, Si, GaN & 3D Packaging


News May 09, 2018 by Paul Shepard
Bel Power Solutions Announces Melcher RCM Chassis-Mount 500 W 1000 W DC-DC Converters for Railway Applications

Bel Power Solutions Announces Melcher RCM Chassis-Mount 500 W 1000 W DC-DC Converters for Railway Applications

Bel Power Solutions and Protection, a Bel group company and premier global manufacturer of power management devices, announces the RCM500 (500 W)…


Harwin Introduces Ultra-Compact Fine Pitch Cable-to-Board Connector Offering

Harwin Introduces Ultra-Compact Fine Pitch Cable-to-Board Connector Offering

Continuing to extend the breadth of its interconnect solutions, Harwin has announced the latest addition to the M40 series.


new products Apr 24, 2018 by Harwin
Rittal Introduces Smart and Small Power Distribution

Rittal Introduces Smart and Small Power Distribution

Rittal North America LLC, the world’s largest manufacturer of industrial enclosures, enclosure accessories and machinery, introduces the RiLine…


Shielded Surface-Mount RF Inductors with Higher Inductance

Shielded Surface-Mount RF Inductors with Higher Inductance

High-end IEC Power Entry Modules now Meet IEC IEC62368-1

High-end IEC Power Entry Modules now Meet IEC IEC62368-1

SE 8 Enclosures Offer Better Value and Durability Than Unibody Enclosures

SE 8 Enclosures Offer Better Value and Durability Than Unibody Enclosures

Rittal North America LLC, the world’s largest enclosure manufacturer and a leader in thermal management of electrical, electronic and IT equipment,


Liquid Cold Plates with Innovative Fin Design Perform 30% Better

Liquid Cold Plates with Innovative Fin Design Perform 30% Better