TI Intros 2 Isolated Power Modules Plus IsoShield Packaging

Today, at the 2026 Applied Power Electronics Conference (APEC) in San Antonio, Texas Instruments unveiled two isolated power modules designed to increase power density, efficiency, and safety in electric vehicles, data centers, and other high-demand applications. The UCC34141-Q1 and the UCC33420 use TI’s proprietary IsoShield technology, which achieves up to three times the power density of discrete solutions in isolated power supplies.

“What this technology enables us to do is integrate a planar transformer into the IC, together with the primary and secondary power stages, so that we have a fully integrated, isolated DC-DC module, effectively,” said David Snook, product line manager for drivers, bias, and bi-directional GaN.

Snook and Kannan Soundarapandian, vice president and general manager for high-voltage products, met with EEPower and other journalists in an advanced briefing.

The UCC 33420. Image used courtesy of Texas Instruments

Power for EVs and Data Centers

While EVs have been the driving force behind innovations in power components, that role will soon be taken by data centers, according to Soundarapandian.

“If you think about the fact that a few years from now, I think by the end of the decade, every watt generated on planet Earth—a third of it—is going to end up in a data center,” he said. “That number is more like 10% right now. So if you see this vast change in how humanity, itself, if you will, consumes energy, that breaks just about every system we have.”

As data centers transition to 800 V architectures, it will change the entire power system, even how the grid has to operate, Soundarapandian said.

“The needs that are being driven by data centers today are massive, from a power density standpoint, from a reliability standpoint,” he remarked. “I think this particular space is going to exceed every need that the automotive space has been driving so far. I’d go so far as to say that today, at this point at least—qualification needs, quality needs, all of those from the semiconductor to space—have been basically been driven by automotive. That is going to switch to data centers going forward.”

The isolated power modules reduce size, weight, and cost. Image used courtesy of TI

TI is working with Nvidia to create 800 V DC power architecture for data centers. A few innovations to date include an 800 V hot-swap controller, an 800 V to 6 V DC-DC bus converter, and a 6 V to <1 V multiphase buck converter.

The isolated power modules and IsoShield packaging technology will allow designers to ensure safe and reliable operation of digital architecture, according to TI.

“Effectively, we will move from a copper and steel type supply chain to a silicon supply chain to be able eto handle this burgeoning marketplace,” Soundarapandian projected. “It’s a massive change that is underway, and that 800 V is only a first step.”

The ISOShield

The IsoShield, which enables an all-in-one system-in-package (SiP) solution, simplifies the design process and saves board space. These features are necessary in applications such as EVs, where size and weight can affect range and efficiency, or in data centers, where safe and reliable operation is essential.

The IsoShield enables a distributed power architecture, which avoids single-point failures and helps designers meet safety requirements. The packaging shrinks solution size by as much as 70%, while delivering up to 2W of power.

“We can actually support all levels of isolation, from functional to basic, up to reinforced isolation capabilities,” Snook explained. “We are able to provide that with the new, integrated products using IsoShield packaging technology.”

IsoShield joins TI’s other packaging solution, MagPack, which was introduced in 2024. MagPack uses integrated magnetic packaging in a proprietary package molding process that enables engineers to pack more power into a smaller space.

MagPack vs. IsoShield. Image used courtesy of TI

“This is extremely valuable because it’s not just a decrease in footprint size or solution size,” Soundarapandian said, speaking of MagPack. “We also get an associated decrease in things like EMC, right? … And just all around better power density by using modules like this.”

TI offers more than 350 power modules with packaging such as MagPack and IsoShield.

Product Rollout

TI is taking preproduction orders for samples of the UCC3420 and the UCC34141-Q1. Evaluation modules, the UCC34141 EVM-116 and the UCC33420EVM-80, are also available.