Low Resistance, High Current Chip Inductors from Taiyo Yuden
Taiyo Yuden (USA) Inc.'s (Schaumburg,IL) new LB3218 wire-wound chip inductors simplify designs, reduce part counts and lower bill-of-material (BOM) costs by combining the functionality of two 3225-size low-resistance (RDC) and high-current inductors into a single 3218-size device.
Measuring 3.2mm L x 1.8mm W x 1.8mm H, the LB3218 is ideal for use in power supply circuits of digital still cameras, camcorders, VCRs and other mature commodity-type equipment formats in which it is difficult or impractical to implement new circuit designs. Compared to larger 3225-size devices (3.2mm L x 2.5mm W x 2.2mm H), the LB3218 is 40% smaller by volume, 20% thinner and offers a 30% smaller device footprint.
Designed as a drop-in replacement for previous-generation LEMF (low RDC) and LEMC (high current) series inductors from Taiyo Yuden, the LB3218 facilitates manufacturability by using the same land pattern as before, thus eliminating any design modifications required for upgrading to LB3218 series parts.
Now available in mass production quantities, the series comes in 16 available part numbers from 0.05 to 6.5Ω and 1000 to 60mA, respectively. The LB3218 offers a wide range of inductance ratings from 1.0-330µH at operating frequencies of 796KHz to 7.96MHz.
Until the LB3218 series, customers had less choice between a low RDC inductor or a high-current model, the design of which proved too difficult to combine the characteristics of both into one device. In response to this design challenge, Taiyo Yuden employed advanced material science and fabrication techniques to redesign the ferrite-resin composite used in previous-generation devices.
The shape of the ferrite core, its thickness and the number of windings were specifically designed to eliminate all wasted space and to produce the highest possible rated current and lowest possible RDC in a 3218-size device. As with other Taiyo Yuden inductors, the non-polarized electrodes of the LB3218 series allow mounting irrespective of device orientation, thus simplifying manufacturability.
