EEPower

Latest Silicon Carbide Articles

Categories

Schurter Announces UAI 1206 a Chip Fuse for High Demands

Schurter Announces UAI 1206 a Chip Fuse for High Demands

With the UAI 1206, SCHURTER offers a pulse and temperature resistant chip fuse with slow release characteristics for applications in which aging…


Power Control at 27 MHz with Variable Reactance

Power Control at 27 MHz with Variable Reactance

This is the second of a three part series. In Part 1, we described a quasi-class E circuit providing variable power into inductive and resistive loads


Sanan IC Announces Commercial Release of 6-Inch SiC Wafer Foundry Process

Sanan IC Announces Commercial Release of 6-Inch SiC Wafer Foundry Process


News Dec 21, 2018 by Paul Shepard
Driving SiC MOSFETs with a HighSpeed Gate Driver IC

Driving SiC MOSFETs with a HighSpeed Gate Driver IC

Silicon-Carbide (SiC) MOSFETs that become a visible part of the MOSFET market require special gate drivers that are able to provide a negative…


Next-Generation SiC Transistors Claim World’s Lowest On-State Resistance

Next-Generation SiC Transistors Claim World’s Lowest On-State Resistance

Chip-type Ceramic Rechargeable Batteries Coming in April 2019

Chip-type Ceramic Rechargeable Batteries Coming in April 2019


News Dec 16, 2018 by Paul Shepard
H-bridge Driver IC Supporting 1.8V Low-Voltage and 4.0A Current Drive

H-bridge Driver IC Supporting 1.8V Low-Voltage and 4.0A Current Drive

Thick-Film Chip Resistors Deliver Industry-Leading TCR Characteristics

Thick-Film Chip Resistors Deliver Industry-Leading TCR Characteristics

Automotive Data Flow Processor Test Chip Announced by NSITEXE

Automotive Data Flow Processor Test Chip Announced by NSITEXE


News Dec 13, 2018 by Paul Shepard
Flip Chip Schottky Diode in Low-Profile WLCSP

Flip Chip Schottky Diode in Low-Profile WLCSP

World’s First Industrial-Grade eSIM in Wafer-Level Chip-Scale Package

World’s First Industrial-Grade eSIM in Wafer-Level Chip-Scale Package


News Dec 10, 2018 by Paul Shepard
New Mechanism for Enhancing Reliability of SiC Power Devices Detailed at IEDM

New Mechanism for Enhancing Reliability of SiC Power Devices Detailed at IEDM


News Dec 06, 2018 by Paul Shepard
TowerJazz and KERI Prototyping SiC FET Gate Driver IC on 0.18um SOI Platform

TowerJazz and KERI Prototyping SiC FET Gate Driver IC on 0.18um SOI Platform


News Dec 03, 2018 by Paul Shepard
UnitedSiC Adds Kelvin Connection Packages into SiC FET Offering

UnitedSiC Adds Kelvin Connection Packages into SiC FET Offering


News Dec 03, 2018 by Paul Shepard
UnitedSiC Introduces Kelvin Connection Parts into UF3C FAST FET Series

UnitedSiC Introduces Kelvin Connection Parts into UF3C FAST FET Series

UnitedSiC expands its UF3C FAST Series product offering by introducing an additional range of 650 V and 1200 V high-performance silicon carbide FETs


Dialog Semiconductor Introduces First Fully-Integrated Nanopower PMICs for Low-Power IoT Applications

Dialog Semiconductor Introduces First Fully-Integrated Nanopower PMICs for Low-Power IoT Applications

Dialog Semiconductor unveiled its first fully-integrated nanopower PMICs for IoT applications: the DA9070 and DA9073.


Long Life Fan-To-Heatsink IC Cooler

Long Life Fan-To-Heatsink IC Cooler

Speed Sensor IC Optimized for Two-Wheeled Vehicles

Speed Sensor IC Optimized for Two-Wheeled Vehicles

Energous and Dialog Partner on Small Form Factor Wireless Power Receiver IC

Energous and Dialog Partner on Small Form Factor Wireless Power Receiver IC


News Nov 27, 2018 by Paul Shepard
One-Chip Solution and Easy-to-Use Dev Kit Simplify IO-Link-Based Applications for Industry 4.0

One-Chip Solution and Easy-to-Use Dev Kit Simplify IO-Link-Based Applications for Industry 4.0