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Integra Technologies Wins Air Force Contract to Accelerate GaN/SiC Readiness

Integra Technologies Wins Air Force Contract to Accelerate GaN/SiC Readiness


News Jun 05, 2019 by Scott McMahan
GaN-on-SiC Transistor for 2.45GHz RF Surpasses Efficiency of Most Magnetrons

GaN-on-SiC Transistor for 2.45GHz RF Surpasses Efficiency of Most Magnetrons


News Jun 05, 2019 by Scott McMahan
Silicon Carbide SiC Products for High-Voltage Reliable Power Electronics

Silicon Carbide SiC Products for High-Voltage Reliable Power Electronics

This article highlights Microchip’s 700V SiC MOSFETs, and 700V and 1200V SiC Schottky Barrier Diodes (SBDs) join its existing portfolio of SiC…


EPC Offers GaN Devices in Wafer Form

EPC Offers GaN Devices in Wafer Form


News Jun 04, 2019 by Scott McMahan
EPC to Provide eGaN Power Devices in Wafer Form

EPC to Provide eGaN Power Devices in Wafer Form

Efficient Power Conversion (EPC) will provide their industry-leading gallium nitride-based power devices in wafer form for ease of power systems…


new products Jun 04, 2019 by EPC
Galvanic-Isolated IGBT Gate Driver IC Evaluation Board

Galvanic-Isolated IGBT Gate Driver IC Evaluation Board


News Jun 03, 2019 by Paul Shepard
Integrated GaAs Tech Enables Single Chip GaAs Solutions For 5G and mmWave

Integrated GaAs Tech Enables Single Chip GaAs Solutions For 5G and mmWave

Toshiba Launches Low Power Consumption Brushed DC Motor Driver IC with Popular Pin assignment HSOP8 Package

Toshiba Launches Low Power Consumption Brushed DC Motor Driver IC with Popular Pin assignment HSOP8 Package

This article highlights Toshiba launched of “TB67H450FNG,” the latest addition to its line-up of brushed DC motor driver ICs with maximum…


MCUs Optimized for GaN- and SiC-Based Digital Power Designs

MCUs Optimized for GaN- and SiC-Based Digital Power Designs


News May 28, 2019 by Paul Shepard
PowerAmerica Updates Wide Bandgap Technology Roadmap

PowerAmerica Updates Wide Bandgap Technology Roadmap


News May 23, 2019 by Paul Shepard
Toyoda Gosei Develops Single-Chip 100A Vertical GaN FET

Toyoda Gosei Develops Single-Chip 100A Vertical GaN FET


News May 23, 2019 by Scott McMahan
Ultra Low-Power Edge AI Chip and 3D Artificial Intelligence Solution

Ultra Low-Power Edge AI Chip and 3D Artificial Intelligence Solution

10W GaN-on-SiC MMIC K/Ka-Band High Power Amplifier

10W GaN-on-SiC MMIC K/Ka-Band High Power Amplifier

SiC-Based 7.4kW/11kW/22kW Onboard Battery Charger for EVs and HEVs

SiC-Based 7.4kW/11kW/22kW Onboard Battery Charger for EVs and HEVs

TI Widens Its Lead as World’s Top Analog IC Supplier, Infineon Climbs to #3

TI Widens Its Lead as World’s Top Analog IC Supplier, Infineon Climbs to #3


News May 20, 2019 by Paul Shepard
Gate Drivers for SiC-MOSFET/IGBT Power Modules and Their Advantages

Gate Drivers for SiC-MOSFET/IGBT Power Modules and Their Advantages

This article highlights Tamura Corporation Gate Drivers module which is the 2DMB series for SiCMOSFET/IGBT power modules that contains DC/DC…


Inorganic Double Helix Semiconductor for Electronics, Solar Technology and Photo Catalysis

Inorganic Double Helix Semiconductor for Electronics, Solar Technology and Photo Catalysis


News May 16, 2019 by Paul Shepard
Accelerating Time-to-Market for High-Power Designs and Wide Bandgap Devices

Accelerating Time-to-Market for High-Power Designs and Wide Bandgap Devices

Vanadium Iodine Found to be 2D Ferromagnetic Semiconductor

Vanadium Iodine Found to be 2D Ferromagnetic Semiconductor


News May 14, 2019 by Scott McMahan
Cree Selected as Silicon Carbide Partner for the Volkswagen Group FAST Program

Cree Selected as Silicon Carbide Partner for the Volkswagen Group FAST Program

Cree, Inc. has been selected as the exclusive silicon carbide partner for the Volkswagen Group’s “Future Automotive Supply Tracks” Initiative…


new products May 14, 2019 by Cree