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Digital Isolator for IGBT Gate Drive for Motor Applications

Digital Isolator for IGBT Gate Drive for Motor Applications

1200V Dual-Channel IGBT Driver Eliminates Opto-Couplers

1200V Dual-Channel IGBT Driver Eliminates Opto-Couplers

X-FAB and Exagan Partner on 200mm GaN-on-Silicon Wafers

X-FAB and Exagan Partner on 200mm GaN-on-Silicon Wafers


News May 18, 2015 by Jeff Shepard
Fairchild Stretching the ‘Ideal’ Limits of Silicon IGBTs

Fairchild Stretching the ‘Ideal’ Limits of Silicon IGBTs

Vertical High-Voltage GaN Power Device Technology

Vertical High-Voltage GaN Power Device Technology

Driver IC for DC Brushed Motor for Automotive Controls

Driver IC for DC Brushed Motor for Automotive Controls

Cascode Switches  the Fast Route to Higher Efficiency

Cascode Switches the Fast Route to Higher Efficiency

This article offers discusses the cascode switches which is the fastest and most cost-effective way to improve the efficiency of SMPS.


Packaging GaN in a TO247

Packaging GaN in a TO247

This article describes how Transphorm Inc. developed a 63 mOhm 600V GaN HEMT (high electron mobility transistor) to be packaged in a TO-247.


SiC and more from ROHM Semiconductor at Techno Frontier

SiC and more from ROHM Semiconductor at Techno Frontier

Co-Packaged SiC Transistor and Diodes in Mini-Modules

Co-Packaged SiC Transistor and Diodes in Mini-Modules

How to Reduce up to 20 Percent of Power Loss in Cordless Power Tools

How to Reduce up to 20 Percent of Power Loss in Cordless Power Tools

This article features an investigation on the feasibility of replacing TO-220 package MOSFETs with a much smaller SuperSO8 package MOSFET


900V / 32A SiC MOSFETs Outperform Silicon

900V / 32A SiC MOSFETs Outperform Silicon

500V Thick-Film Chip Resistors in 0805 and 1206 Sizes

500V Thick-Film Chip Resistors in 0805 and 1206 Sizes

Akros Silicon Announces New Shanghai Office

Akros Silicon Announces New Shanghai Office


News May 04, 2015 by Jeff Shepard
Are Costs Falling for both Power and Digital Semis?

Are Costs Falling for both Power and Digital Semis?


News May 04, 2015 by Jeff Shepard
Precision High-Temp Thin-Film Chip Resistors

Precision High-Temp Thin-Film Chip Resistors

Designing an Efficient Amplifier for a Wireless Power Transfer System

Designing an Efficient Amplifier for a Wireless Power Transfer System

Efficient Power Conversion Corporation announced the publication of a practical engineering handbook designed to provide power system design…


new products May 01, 2015 by EPC
2000V Power MOSFETs to High Voltage Product Portfolio

2000V Power MOSFETs to High Voltage Product Portfolio

IXYS Corporation announced an expansion of its high voltage Power MOSFET product portfolio, the 2000V N-Channel Power MOSFETs


new products May 01, 2015 by IXYS
Little Box Challenge to design cooling of a kilowatt-scale inverter

Little Box Challenge to design cooling of a kilowatt-scale inverter

Mersen has accepted Google’s “Little Box Challenge” to design a power inverter that is about 10 times smaller than what is available today.


new products May 01, 2015 by Mersen
Innovation Award 2015 and Young Engineer Award

Innovation Award 2015 and Young Engineer Award

SEMIKRON Foundation and ECPE honour Mr. Otto Kreutzer and Mr. Alexander Wirth just as Mr. Mickey Madsen with the Innovation Award 2015 and Mr.…


new products May 01, 2015 by SEMIKRON