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Schurter Announces UAI 1206 a Chip Fuse for High Demands

Schurter Announces UAI 1206 a Chip Fuse for High Demands

With the UAI 1206, SCHURTER offers a pulse and temperature resistant chip fuse with slow release characteristics for applications in which aging…


Power Control at 27 MHz with Variable Reactance

Power Control at 27 MHz with Variable Reactance

This is the second of a three part series. In Part 1, we described a quasi-class E circuit providing variable power into inductive and resistive loads


Cost Optimization of Wireless Power Transmission Systems

Cost Optimization of Wireless Power Transmission Systems

Advantages of wireless power transmission systems in comparison to standard plug contacts are easily identified. Power transmitters, as well as…


Driving SiC MOSFETs with a HighSpeed Gate Driver IC

Driving SiC MOSFETs with a HighSpeed Gate Driver IC

Silicon-Carbide (SiC) MOSFETs that become a visible part of the MOSFET market require special gate drivers that are able to provide a negative…


Third-Generation 0.18-Micron Bipolar-CMOS-DMOS Process Technology

Third-Generation 0.18-Micron Bipolar-CMOS-DMOS Process Technology


News Dec 20, 2018 by Paul Shepard
Dual-Channel Isolated MOSFET Gate Driver ICs with Accurate and Stable Timing

Dual-Channel Isolated MOSFET Gate Driver ICs with Accurate and Stable Timing

Bidirectional 8-Channel Level Shifter from Diodes Incorporated Offers Wide Voltage Range and Flexible Output Options

Bidirectional 8-Channel Level Shifter from Diodes Incorporated Offers Wide Voltage Range and Flexible Output Options

Diodes Incorporated announced the PI4ULS5V108, an 8-channel, high speed, bidirectional level shifter designed for inter-IC communications.


Maximizing System Efficiency with IGBT Modules

Maximizing System Efficiency with IGBT Modules

With the recent push from both the wider industry sectors and the government for high-efficiency systems, the semiconductor industry is responding…


ASIL-Certified BLDC System Basis MOSFET Driver

ASIL-Certified BLDC System Basis MOSFET Driver

Designing Safe and Fast DC Charging Stations with Optocouplers

Designing Safe and Fast DC Charging Stations with Optocouplers

Rapid growth of electric vehicle (EV) fleet drives strong demand for charging infrastructure to extend EVs’ travel range. DC fast charging…


Chip-type Ceramic Rechargeable Batteries Coming in April 2019

Chip-type Ceramic Rechargeable Batteries Coming in April 2019


News Dec 16, 2018 by Paul Shepard
H-bridge Driver IC Supporting 1.8V Low-Voltage and 4.0A Current Drive

H-bridge Driver IC Supporting 1.8V Low-Voltage and 4.0A Current Drive

Thick-Film Chip Resistors Deliver Industry-Leading TCR Characteristics

Thick-Film Chip Resistors Deliver Industry-Leading TCR Characteristics

Automotive Data Flow Processor Test Chip Announced by NSITEXE

Automotive Data Flow Processor Test Chip Announced by NSITEXE


News Dec 13, 2018 by Paul Shepard
Flip Chip Schottky Diode in Low-Profile WLCSP

Flip Chip Schottky Diode in Low-Profile WLCSP

7th Gen NX Type Converter Inverter Brake Modules

7th Gen NX Type Converter Inverter Brake Modules

Applications such as elevator drives or servomotors have several special requirements. One on hand, high efficiency is important, while on the…


High-Current IGBT Gate Driver with Active Miller Clamp

High-Current IGBT Gate Driver with Active Miller Clamp

World’s First Industrial-Grade eSIM in Wafer-Level Chip-Scale Package

World’s First Industrial-Grade eSIM in Wafer-Level Chip-Scale Package


News Dec 10, 2018 by Paul Shepard
Designing Custom Inductors vs Utilizing ReadyMade Options

Designing Custom Inductors vs Utilizing ReadyMade Options

Engineers are under time and budget pressures to complete their tasks efficiently. Designing a power supply can be a daunting task, especially for…


650V D-Mode GaN HEMTs Produced on 200mm Gan-on-Si Wafers with CMOS-Compatible Process

650V D-Mode GaN HEMTs Produced on 200mm Gan-on-Si Wafers with CMOS-Compatible Process


News Dec 06, 2018 by Paul Shepard