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MACOM Announces Preliminary Injunction against Infineon

MACOM Announces Preliminary Injunction against Infineon


News Dec 19, 2016 by Jeff Shepard
SiC Technology Introduced into Formula E

SiC Technology Introduced into Formula E

ROHM Semiconductor presented its cutting-edge silicon carbide (SiC) technology at the first race of the new 2016/2017 Formula E season in Hong Kong.


new products Dec 19, 2016 by ROHM
The Rugged 62Pak IGBT Module Range Employing the Next Generation 1700V SPT Chip Set for 175C Operation

The Rugged 62Pak IGBT Module Range Employing the Next Generation 1700V SPT Chip Set for 175C Operation

This article features the ABB's third generation of 1700V SPT++ IGBTs which is capable of operating up to a max temperature of 175˚C.


Transphorm’s Fully-Packaged GaN FETs Available Through Digi-Key

Transphorm’s Fully-Packaged GaN FETs Available Through Digi-Key


News Dec 15, 2016 by Jeff Shepard
Multi-Function System Power IC for SSDs

Multi-Function System Power IC for SSDs

Miniaturization with High-Temperature Surface-Mount Silicon Controlled Rectifiers

Miniaturization with High-Temperature Surface-Mount Silicon Controlled Rectifiers

STMicroelectronics has introduced the industry’s first 800V surface-mount Silicon Controlled Rectifiers (SCR, or thyristor) specified for…


Atomera to Discuss Semiconductor Materials Advancements

Atomera to Discuss Semiconductor Materials Advancements

Chip Bead Inductors for Power Lines for LED Lighting

Chip Bead Inductors for Power Lines for LED Lighting

Next-Generation Output Transistor Arrays

Next-Generation Output Transistor Arrays

Toshiba Electronics Europe has announced a series of next-generation output transistor arrays that feature a DMOS FET type sink output.


Fabless Actions Semiconductor Going Private

Fabless Actions Semiconductor Going Private


News Dec 12, 2016 by Jeff Shepard
105 Degrees C Conductive Polymer Chip Capacitors

105 Degrees C Conductive Polymer Chip Capacitors

Polymer Solid Electrolytic Multianode Chip Capacitors

Polymer Solid Electrolytic Multianode Chip Capacitors

Toshiba Adds SOIC Packages to Lineup of CMOS Logic ICs

Toshiba Adds SOIC Packages to Lineup of CMOS Logic ICs

High Performance Analog offers Superior Noise Performance

High Performance Analog offers Superior Noise Performance


News Dec 07, 2016 by Jeff Shepard
Technology Trends Raising Power-Conversion Efficiency

Technology Trends Raising Power-Conversion Efficiency

This article discusses the advances in superjunction MOSFETs and SiC Rectifiers and how they can improve on-resistance and noise of power supply…


£10 Million Award Creates Compound Semiconductor Hub

£10 Million Award Creates Compound Semiconductor Hub


News Dec 06, 2016 by Jeff Shepard
InSe Semiconductors Could Extend Life of Moore’s Law

InSe Semiconductors Could Extend Life of Moore’s Law


News Dec 06, 2016 by Jeff Shepard
Reverse Conducting IGCT Platform optimized for Modular Multilevel Converters MMC

Reverse Conducting IGCT Platform optimized for Modular Multilevel Converters MMC

This article discusses the technical aspects of ABB's newly developed Reverse Conducting Integrated Gate Commutated Thyristor (RC-IGCT) platform.


Seven-Port USB 3.1 Gen1 Hub IC for USB Type-C

Seven-Port USB 3.1 Gen1 Hub IC for USB Type-C

3D Solutions to Energy Savings in Silicon IGBTs

3D Solutions to Energy Savings in Silicon IGBTs


News Dec 04, 2016 by Jeff Shepard