200µm-Thick Thermal Material for IGBT Modules

Panasonic Automotive & Industrial Systems Europe has launched a highly-compressible Thermal Interface Material (TIM) which is used to reduce contact thermal resistance between rough surfaces in extremely thin spaces. Soft-PGS enhances the thermal coupling between heat producing devices and heat dissipation devices (the heat sinks).

Soft PGS is a key component in the majority of power electronic systems. Heat generated by semiconductors has to be transferred to a heat sink and ultimately dissipated. Soft-PGS is a 200µm thick graphite sheet designed for use as a thermal interface material for IGBT modules. As Soft-PGS can be compressed by 40% it is an excellent method for dramatically reducing thermal resistance between a heat sink and an IGBT module.

The 200µm thick Soft-PGS sheet is easy to install, and has far lower labor and installation costs than thermal grease or phase change material. Soft-PGS guarantees a thermal stability of up to 400 degrees C and high reliability against intense heat cycles (-50 to +150 degrees C). Its thermal conductivity is guaranteed at 400W/mK for X-Y direction and at 30W/mK in Z direction. Panasonic offers a wide range of standard sheets for different IGBT modules from various suppliers.

Comments Simone Saile, Product Manager, Thermal Solutions & Ceramic Devices at Panasonic: “As the volume of the heat sink reduces and local power densities increase, there are greater demands on the thermal interface connecting power electronic components to the heat sink. A paste-like TIM-layer is never of homogenous thickness; also, most paste-like thermal solutions degrade over time. Compared to thermal grease and PCM, Soft-PGS fits uneven surfaces far better as well as offering superior workability, reliability and thermal stability.”