This article describes the basic points of the X-Series design including the improvements contributing to a safe…
This article describes the basic points of the X-Series design including the improvements contributing to a safe operation of the device.
This article discusses the new standard dual-module package specially developed for High Voltage IGBTs HVIGBTs used in…
This article discusses the new standard dual-module package specially developed for High Voltage IGBTs HVIGBTs used in railway applications.
This article describes the challenges of inverter-based induction cooking and introduces a new technology that meets the…
This article describes the challenges of inverter-based induction cooking and introduces a new technology that meets the technical and price…
This article features Allegro Microsystems' ALS31000, a unidirectional linear Hall sensor integrated circuit for…
This article features Allegro Microsystems' ALS31000, a unidirectional linear Hall sensor integrated circuit for automotive and industrial…
This article discusses the application of technologies of low-temperature sintering of silicon wafers and molybdenum…
This article discusses the application of technologies of low-temperature sintering of silicon wafers and molybdenum discs using the silver…
Littelfuse, Inc. introduces its new series of three unidirectional TVS diode arrays in space-saving 01005 flip-chip packages
Littelfuse, Inc. introduces its new series of three unidirectional TVS diode arrays in space-saving 01005 flip-chip packages
The 62nd annual IEEE International Electron Devices Meeting, (IEDM) was held in San Francisco, California, USA December 3…
The 62nd annual IEEE International Electron Devices Meeting, (IEDM) was held in San Francisco, California, USA December 3 - 7, 2016. For more than six
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