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Integrated Silicon III-V Chips to be Commercially Available in 2020

Integrated Silicon III-V Chips to be Commercially Available in 2020

News Sep 30, 2019 by Paul Shepard
Capacitors Optimized for Fast Switching Wide Bandgap Semiconductor Designs

Capacitors Optimized for Fast Switching Wide Bandgap Semiconductor Designs

new products Sep 30, 2019 by Paul Shepard
Power Integrations Delivers One-Millionth GaN-Based InnoSwitch3 IC

Power Integrations Delivers One-Millionth GaN-Based InnoSwitch3 IC

News Sep 30, 2019 by Paul Shepard
KEMET Introduces New KC-LINK™ Capacitor Series

KEMET Introduces New KC-LINK™ Capacitor Series

KEMET Introduces New KC-LINK™ Capacitor Series.

new products Sep 30, 2019 by KEMET Electronics Corporation
EconoDUAL 3 has Highest Power Density and Performance Using New IGBT7

EconoDUAL 3 has Highest Power Density and Performance Using New IGBT7

This article highlights Infineon chipset of IGBT7 and emitter-controlled 7 diode that is user-friendly and optimized to fulfill the GPD requirements.

Technical Articles Sep 30, 2019 by Klaus Vogel
Mitsubishi Develops Trench-Type SiC-MOSFET with Unique Electric-Field-Limiting Structure

Mitsubishi Develops Trench-Type SiC-MOSFET with Unique Electric-Field-Limiting Structure

News Sep 29, 2019 by Paul Shepard
Steifpower Selects SkyWater to Fab High Efficiency Discrete Power Devices

Steifpower Selects SkyWater to Fab High Efficiency Discrete Power Devices

News Sep 29, 2019 by Paul Shepard
SiC to Enable 1MW Inverter in the Size of a Compact Suitcase

SiC to Enable 1MW Inverter in the Size of a Compact Suitcase

News Sep 27, 2019 by Paul Shepard
Gallium Nitride Discovery Aims for Efficient P-Type GaN Transistors

Gallium Nitride Discovery Aims for Efficient P-Type GaN Transistors

News Sep 26, 2019 by Paul Shepard
Toshiba Launches High-Voltage Dual-Channel Solenoid Driver IC

Toshiba Launches High-Voltage Dual-Channel Solenoid Driver IC

new products Sep 26, 2019 by Paul Shepard
New Open, Physical Interconnect Specification to Efficiently Connect Chiplets

New Open, Physical Interconnect Specification to Efficiently Connect Chiplets

News Sep 26, 2019 by Paul Shepard
Toshiba Launches High Voltage Dual Channel Solenoid Driver IC

Toshiba Launches High Voltage Dual Channel Solenoid Driver IC

This article highlights Toshiba Electronics Europe GmbH dual-channel solenoid driver IC that provides a high-voltage drive with low ON resistance.

new products Sep 26, 2019 by Toshiba Europe
10kW Bi-Directional, Dual Active Bridge Reference Design with SiC MOSFETs

10kW Bi-Directional, Dual Active Bridge Reference Design with SiC MOSFETs

News Sep 25, 2019 by Paul Shepard
II-VI Expands Compound Semi Business with Completion of Finisar Acquisition

II-VI Expands Compound Semi Business with Completion of Finisar Acquisition

News Sep 25, 2019 by Paul Shepard
Accurate Emulation of AC and DC Loads can Speed Time to Market for Complex ASIC-Based Designs

Accurate Emulation of AC and DC Loads can Speed Time to Market for Complex ASIC-Based Designs

new products Sep 25, 2019 by Paul Shepard
ROHM Announces New AutomotiveGrade Backlight LED Driver Optimized for LCD Panels

ROHM Announces New AutomotiveGrade Backlight LED Driver Optimized for LCD Panels

ROHM announced the availability of the latest LED driver IC, the BD81A76EFV-M, optimized for LCD backlight in instrument cluster, center…

new products Sep 25, 2019 by ROHM
GLFs Introduces Ultra-High-Efficiency 45A Two-Input Power Mux for IoT Applications

GLFs Introduces Ultra-High-Efficiency 45A Two-Input Power Mux for IoT Applications

This article highlights GLD GLF74130, a two-input Power Mux IC that offers significant efficiency improvement over traditional diode-based solutions.

new products Sep 25, 2019 by GLF Integrated Power
A High Temperature Gate Driver for Half Bridge SiC MOSFET 62mm Power Modules

A High Temperature Gate Driver for Half Bridge SiC MOSFET 62mm Power Modules

This article features CISSOID CMT-TIT8243 high temperature high voltage isolated Gate Driver for 62mm SiC MOSFET power modules with High peak gate…

Technical Articles Sep 25, 2019 by Pierre Delatte
Elmos to sell Silicon Microstructures Inc. to TE Connectivity for $95 Million

Elmos to sell Silicon Microstructures Inc. to TE Connectivity for $95 Million

News Sep 24, 2019 by Paul Shepard
SOI Industry Consortium Announces Awards During Shanghai Event

SOI Industry Consortium Announces Awards During Shanghai Event

The SOI Industry Consortium announced awards to two luminaries of the semiconductor industry.

new products Sep 24, 2019 by SOI Industry Consortium