EEPower

Latest Semiconductors & ICs Articles

Categories

Finepower Packs 3kW GaN-Based On-Board Charger into One Liter

Finepower Packs 3kW GaN-Based On-Board Charger into One Liter

ZF and Danfoss Seal Strategic Partnership on Si and SiC Power for Electric Drivelines

ZF and Danfoss Seal Strategic Partnership on Si and SiC Power for Electric Drivelines


News Nov 14, 2019 by Paul Shepard
A Step Forward to Miniaturization for Current Sensing in Power Conversion Systems

A Step Forward to Miniaturization for Current Sensing in Power Conversion Systems

This article highlights LEM HMSR current sensor models that include a low-resistance primary conductor, a miniature ferrite, and a proprietary ASIC.


Chip for Waking Up Small Wireless IoT Nodes Could Extend Battery Life

Chip for Waking Up Small Wireless IoT Nodes Could Extend Battery Life


News Nov 12, 2019 by Paul Shepard
Navitas GaN Power IC Enables Credit-Card-Size 100W Charger

Navitas GaN Power IC Enables Credit-Card-Size 100W Charger

Automated X-ray Inspection for IGBT Power Modules

Automated X-ray Inspection for IGBT Power Modules

GTAT ISO-9001:2015 Certification for Silicon Carbide

GTAT ISO-9001:2015 Certification for Silicon Carbide


News Nov 11, 2019 by Paul Shepard
The Future of GaN: An Interview with Alex Lidow of EPC

The Future of GaN: An Interview with Alex Lidow of EPC

Ahead of December’s Power Conference in Munich, Bodo Arlt took the opportunity to get an insight into Dr. Alex Lidow’s thoughts on where the…


tech insights Nov 11, 2019 by Bodo Arlt
Current Sensors Measure up to 2kA AC or DC for SiC or GaN Inverter Designs

Current Sensors Measure up to 2kA AC or DC for SiC or GaN Inverter Designs

APEX Introduces MP165 High Voltage MOSFET

APEX Introduces MP165 High Voltage MOSFET

APEX Introduces MP165 High Voltage MOSFET.


European Project Aims to Develop Beta-Gallium Oxide Power Devices

European Project Aims to Develop Beta-Gallium Oxide Power Devices


News Nov 08, 2019 by Paul Shepard
Power Integrity Solution for Signoff Timing-Aware IR Drop Analysis

Power Integrity Solution for Signoff Timing-Aware IR Drop Analysis


News Nov 08, 2019 by Paul Shepard
Transphorm Ships Over Half a Million GaN Power Devices for Multi-kilowatt Class Applications

Transphorm Ships Over Half a Million GaN Power Devices for Multi-kilowatt Class Applications

Transphorm Ships Over Half a Million GaN Power Devices for Multi-kilowatt Class Applications.


new products Nov 08, 2019 by Transphorm
TAIYO YUDEN Launched Automotive Chip Bead Inductor with an Operating Temperature of 150ºC

TAIYO YUDEN Launched Automotive Chip Bead Inductor with an Operating Temperature of 150ºC

TAIYO YUDEN Launched Automotive Chip Bead Inductor with an Operating Temperature of 150°C.


new products Nov 08, 2019 by Taiyo Yuden
GaN-Based, Modular Smart Power Management IoT Solution

GaN-Based, Modular Smart Power Management IoT Solution

125°C Chip-Type Conductive Polymer Aluminum Solid Electrolytic Capacitors

125°C Chip-Type Conductive Polymer Aluminum Solid Electrolytic Capacitors

Transphorm Ships Over Half a Million GaN Power Devices for Multi-Kilowatt Applications

Transphorm Ships Over Half a Million GaN Power Devices for Multi-Kilowatt Applications


News Nov 07, 2019 by Paul Shepard
GaN FETs and Synchronous Rectification in 93.4% Efficient, 100-W AC-DC Reference Design

GaN FETs and Synchronous Rectification in 93.4% Efficient, 100-W AC-DC Reference Design


News Nov 07, 2019 by Paul Shepard
CoolSiC™ MOSFET Evaluation Board for Motor Drives up to 7.5kW

CoolSiC™ MOSFET Evaluation Board for Motor Drives up to 7.5kW


News Nov 06, 2019 by Paul Shepard
Taiwan Semiconductor Introduces 45V and 60V Trench Schottky Rectifiers in SMPc46U Package

Taiwan Semiconductor Introduces 45V and 60V Trench Schottky Rectifiers in SMPc46U Package

Taiwan Semiconductor Introduces 45V and 60V Trench Schottky Rectifiers in SMPc4.6U Package for Automotive Market.