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Fraunhofer’s Modul Project Aims to Embed SiC Power Devices into Substrates

Fraunhofer’s Modul Project Aims to Embed SiC Power Devices into Substrates

News Oct 19, 2019 by Paul Shepard
3-Phase Inverter Demo Board can use IGBTs or Power MOSFETs

3-Phase Inverter Demo Board can use IGBTs or Power MOSFETs

News Oct 18, 2019 by Paul Shepard
Improving Efficiency with GaN + Multi-Objective Optimization & Nonlinear Control

Improving Efficiency with GaN + Multi-Objective Optimization & Nonlinear Control

News Oct 17, 2019 by Paul Shepard
Single-Chip ASIL-D-Compliant Battery Management IC for Mid-to-Large Cell Counts

Single-Chip ASIL-D-Compliant Battery Management IC for Mid-to-Large Cell Counts

new products Oct 17, 2019 by Paul Shepard
Gallium-Nitride Enables World’s Smallest Adapter for World’s Fastest Laptop

Gallium-Nitride Enables World’s Smallest Adapter for World’s Fastest Laptop

News Oct 16, 2019 by Paul Shepard
64-Channel High-Voltage Switch IC from STMicroelectronics Drives Portability with Performance in Medical and Industrial Imaging

64-Channel High-Voltage Switch IC from STMicroelectronics Drives Portability with Performance in Medical and Industrial Imaging

This article features STMicroelectronics STHV64SW 64-channel high-voltage analog-switch IC with unprecedented integration for advanced ultrasound…

new products Oct 16, 2019 by STMicroelectronics
Alpha and Omega Semiconductor Introduces Ultra-Low Clamping Voltage High-Surge TVS

Alpha and Omega Semiconductor Introduces Ultra-Low Clamping Voltage High-Surge TVS

This article highlights Alpha and Omega Semiconductor  AOZ8621UNI Transient Voltage Suppressor (TVS) for VBUS protection with high-surge TVS…

new products Oct 16, 2019 by Alpha and Omega Semiconductor
Demystifying the Paralleling of IGBT Modules

Demystifying the Paralleling of IGBT Modules

Demystifying the Paralleling of IGBT Modules.

Technical Articles Oct 16, 2019 by Thomas Schutze
Evaluating Power Integrity and More in Automotive SoC Devices

Evaluating Power Integrity and More in Automotive SoC Devices

News Oct 15, 2019 by Paul Shepard
EMC Filters for GaN- and SiC-Based Power Converters

EMC Filters for GaN- and SiC-Based Power Converters

new products Oct 15, 2019 by Paul Shepard
64-Channel High-Voltage Switch IC for Medical and Industrial Imaging

64-Channel High-Voltage Switch IC for Medical and Industrial Imaging

new products Oct 15, 2019 by Paul Shepard
AEC Q101 GaN FET Helps Time-of-Flight Lidar Systems ‘See’ Better

AEC Q101 GaN FET Helps Time-of-Flight Lidar Systems ‘See’ Better

new products Oct 15, 2019 by Paul Shepard
1-kW, 80 Plus Titanium, GaN + Silicon Digital AC-DC Power Supply Reference Design

1-kW, 80 Plus Titanium, GaN + Silicon Digital AC-DC Power Supply Reference Design

News Oct 15, 2019 by Paul Shepard
Industry-First Energy Harvesting Power Management Chip for Biometric Payment Devices

Industry-First Energy Harvesting Power Management Chip for Biometric Payment Devices

new products Oct 14, 2019 by Paul Shepard
The Intelligent Power Module Concept for Motor Drive Inverters

The Intelligent Power Module Concept for Motor Drive Inverters

This article highlights Mitsubishi Electric Europe B.V. DIPIPM™ series package that offers the highest level of integration and compactness for…

Technical Articles Oct 14, 2019 by Philipp Jabs
GaN Totem-Pole PFC Design Guide and Power Loss Modeling

GaN Totem-Pole PFC Design Guide and Power Loss Modeling

News Oct 11, 2019 by Paul Shepard
200mm Semi-Insulating SiC Substrates for RF Power Amplifiers in 5G Antennas

200mm Semi-Insulating SiC Substrates for RF Power Amplifiers in 5G Antennas

News Oct 11, 2019 by Paul Shepard
Fraunhofer IZM is Putting the Electric Car in the Fast Lane

Fraunhofer IZM is Putting the Electric Car in the Fast Lane

Fraunhofer IZM is Putting the Electric Car in the Fast Lane.

new products Oct 11, 2019 by Fraunhofer IZM
Samsung Electronics Develops Industry’s First 12-Layer 3D-TSV Chip Packaging

Samsung Electronics Develops Industry’s First 12-Layer 3D-TSV Chip Packaging

News Oct 10, 2019 by Paul Shepard
STMicroelectronics’ STSPIN Modules Add High-Performing Motor Drivers to MikroElektronika Fusion for Arm Ecosystem

STMicroelectronics’ STSPIN Modules Add High-Performing Motor Drivers to MikroElektronika Fusion for Arm Ecosystem

STSPIN Modules from STMicroelectronics Add High-Performing Motor Drivers to MikroElektronika Fusion for Arm Ecosystem.

new products Oct 10, 2019 by STMicroelectronics