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 Value Enhancement of Full SiC 3.3kV Power Module

Value Enhancement of Full SiC 3.3kV Power Module

This article focuses on the 2-level inverter and use this topology to exhibit the results


CISSOID Introduces New SiC Mosfet Intelligent Power Module for E-Mobility

CISSOID Introduces New SiC Mosfet Intelligent Power Module for E-Mobility

The IPM technology offers an all-in-one solution including a 3-Phase water-cooled SiC MOSFET module with built-in gate drivers.


new products Mar 09, 2020 by CISSOID
Materials Science Changes the Electronics World: An Interview with Dr. Andy Mackie of Indium Corporation

Materials Science Changes the Electronics World: An Interview with Dr. Andy Mackie of Indium Corporation

Dr. Andy Mackie, Senior Product Manager of Semiconductor and Advanced Assembly Materials at Indium Corporation talks about the company as a premier…


STMicroelectronics to Acquire Majority Stake in Gallium Nitride Innovator Exagan

STMicroelectronics to Acquire Majority Stake in Gallium Nitride Innovator Exagan

Exagan’s expertise will broaden and accelerate ST’s power GaN roadmap and business for automotive, industrial, and consumer applications.


News Mar 07, 2020 by STMicroelectronics
Ultra-High CMTI Isolated Gate Drivers for SiC or GaN FETs

Ultra-High CMTI Isolated Gate Drivers for SiC or GaN FETs

Powering the Wearables Market: An Interview with Andrew Baker of Maxim Integrated

Powering the Wearables Market: An Interview with Andrew Baker of Maxim Integrated

Maxim Integrated’s healthcare unit looks to make wearables more powerful and medically useful for consumers.


3-Phase Silicon Carbide MOSFET Intelligent Power Module for E-Mobility

3-Phase Silicon Carbide MOSFET Intelligent Power Module for E-Mobility

STMicroelectronics and Alps Alpine Partner on Class-D Amplifier

STMicroelectronics and Alps Alpine Partner on Class-D Amplifier

SiC and Digital Control Enable 3.3kW Bidirectional Power Converter Eval Board

SiC and Digital Control Enable 3.3kW Bidirectional Power Converter Eval Board

FTDI Launches Dual & Quad Channel USB-to-UART/MPSSE Bridge ICs

FTDI Launches Dual & Quad Channel USB-to-UART/MPSSE Bridge ICs

FTDI Chip 2-channel (FT2233HP) and 4-channel (FT4233HP) versions are the Hi-Speed (480Mbits/s) devices have serial UART (RS232, RS422 or RS485) and…


new products Mar 04, 2020 by FTDI Chip
Web Simulation Tool for Complete Circuit Verification for Power Devices and ICs

Web Simulation Tool for Complete Circuit Verification for Power Devices and ICs


News Mar 04, 2020 by Paul Shepard
Plug-and-Play Gate Drivers from Power Integrations Suit Press-Pack IGBT Modules

Plug-and-Play Gate Drivers from Power Integrations Suit Press-Pack IGBT Modules

These new gate-drivers are perfectly are best used in high-reliability applications such as HVDC VSC, STATCOM/FACTS, and medium-voltage drives.


ROHM’s Web Simulation Tool Completes Circuit Verification for Power Devices and ICs

ROHM’s Web Simulation Tool Completes Circuit Verification for Power Devices and ICs

The ROHM Solution Simulator allows designers of electronic circuits and systems in the automotive and industrial markets to simultaneously verify…


new products Mar 04, 2020 by ROHM
Plug-and-Play Gate Drivers Suit 4.5kV Press-Pack IGBT Modules

Plug-and-Play Gate Drivers Suit 4.5kV Press-Pack IGBT Modules

Graphene, Perovskites, and Silicon – an Ideal Tandem for Efficient Solar Cells

Graphene, Perovskites, and Silicon – an Ideal Tandem for Efficient Solar Cells


News Mar 04, 2020 by Paul Shepard
Transphorm Raises $21 Million and Completes Reverse Merger

Transphorm Raises $21 Million and Completes Reverse Merger

The merger helps complete the financing to advance Transphorm's GaN power conversion business.


News Mar 03, 2020 by Transphorm
SK Siltron Completes Acquisition of DuPont’s Silicon Carbide Wafer Division

SK Siltron Completes Acquisition of DuPont’s Silicon Carbide Wafer Division


News Mar 03, 2020 by Paul Shepard
Ultra-Precision Thin-Film Flat Chip Resistors Now in 0402 Case Size

Ultra-Precision Thin-Film Flat Chip Resistors Now in 0402 Case Size

EPC to Launch ePower Stage IC Family at APEC 2020

EPC to Launch ePower Stage IC Family at APEC 2020


News Mar 02, 2020 by Paul Shepard
Versatile IGBT Power Modules for Demanding Industrial and Automotive Applications

Versatile IGBT Power Modules for Demanding Industrial and Automotive Applications

This article provides an overview of the versatile combinations of chipsets and packaging and the resulting performance.