With a footprint of 64.9 x 60mm, a height of 32mm and a light weight of 250g, this compact device is suitable for 1U…
With a footprint of 64.9 x 60mm, a height of 32mm and a light weight of 250g, this compact device is suitable for 1U power supplies and other…
Microchip introduces SiC SBD Modules that utilizes Microchip's newest generation of SiC die.
Microchip introduces SiC SBD Modules that utilizes Microchip's newest generation of SiC die.
Infineon introduces new devices in its new family of integrated-point-of-load voltage regulators.
Infineon introduces new devices in its new family of integrated-point-of-load voltage regulators.
This article discusses Pre-Switch's solution for the elimination of switching losses by incorporating AI into the…
This article discusses Pre-Switch's solution for the elimination of switching losses by incorporating AI into the Auxiliary Resonant…
This article discusses the Modular DC-DC converters and their recent developments in terms of power density.
This article discusses the Modular DC-DC converters and their recent developments in terms of power density.
The Connected Lighting Platform for LED control features multiple forms of connectivity, including Bluetooth Low Energy,…
The Connected Lighting Platform for LED control features multiple forms of connectivity, including Bluetooth Low Energy, provided by the RSL10 SIP,…
As Eaton closes the sale of its LED and lighting operation, the company moves to bolster its strengths in aerospace, EV,…
As Eaton closes the sale of its LED and lighting operation, the company moves to bolster its strengths in aerospace, EV, power distribution and…
This article gives insight on Source-Down packaging technology, a key enabler for delivering the required power density…
This article gives insight on Source-Down packaging technology, a key enabler for delivering the required power density to feed the power-hungry…
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