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Digital Power Comes of Age

Digital Power Comes of Age

This article describes the factors that have driven the evolution of distributed power architectures of HF DC-DC converter modules and offers…

Technical Articles Dec 15, 2014 by Mark Adams
Ultrathin 3A µModule Regulator for Backside PCB Assembly

Ultrathin 3A µModule Regulator for Backside PCB Assembly

new products Nov 30, 2014 by Jeff Shepard
Subminiature Switches Reduce Manual Assembly Time

Subminiature Switches Reduce Manual Assembly Time

new products Nov 20, 2014 by Jeff Shepard
High Power Density Dual nHPD2 Packaging Generation

High Power Density Dual nHPD2 Packaging Generation

This article introduces Hitachi's nHPD2 and its benefits in terms of market potential, performance, modularity and ease of transition.

Technical Articles Nov 17, 2014 by Neil Markham
THERM-A-GAP Gel with Conductivity Extensions to 6 W/m-k

THERM-A-GAP Gel with Conductivity Extensions to 6 W/m-k

new products Nov 13, 2014 by Power Pulse1595211359
Adhesive Thermal Laminate Solves CTE-Mismatch Challenges

Adhesive Thermal Laminate Solves CTE-Mismatch Challenges

new products Nov 11, 2014 by Power Pulse1595211359
Surface-Mount 75V FETs Feature Ultra-low Rds(on) for Industrial Applications

Surface-Mount 75V FETs Feature Ultra-low Rds(on) for Industrial Applications

new products Nov 06, 2014 by Jeff Shepard
Screw-Terminal Electrolytic Caps with High Ripple Capability

Screw-Terminal Electrolytic Caps with High Ripple Capability

new products Oct 26, 2014 by Jeff Shepard
Stud-Mount Edgewound Power Resistors Rated up to 85A

Stud-Mount Edgewound Power Resistors Rated up to 85A

new products Oct 23, 2014 by Jeff Shepard
Thermal Simulation Tool Reduces System Development Times

Thermal Simulation Tool Reduces System Development Times

new products Oct 22, 2014 by Jeff Shepard
Thermal Efficiency of Chipscale Packaging for eGaN® FETs

Thermal Efficiency of Chipscale Packaging for eGaN® FETs

This article discusses the thermal performance of the chipscale package and compare with the state-of-the-art power MOSFET packaging available today.

Technical Articles Oct 17, 2014 by David Reusch
Screw-Terminal Aluminum Capacitors Feature Life of 10,000 Hrs at 85

Screw-Terminal Aluminum Capacitors Feature Life of 10,000 Hrs at 85

new products Oct 15, 2014 by Jeff Shepard
Analysing Thermal Performance of Intelligent Power Modules for Better PCB Design

Analysing Thermal Performance of Intelligent Power Modules for Better PCB Design

This article discusses module thermal performance under various operating conditions to predict operating temperature, power and PCB design for…

Technical Articles Oct 11, 2014 by Stefano Ruzza
Rugged and Accurate Encoder Reduces Assembly Time on BLDC Motors

Rugged and Accurate Encoder Reduces Assembly Time on BLDC Motors

new products Oct 07, 2014 by Jeff Shepard
Surface-Mount High-Voltage Thin-Film Resistor Divider Network

Surface-Mount High-Voltage Thin-Film Resistor Divider Network

new products Sep 29, 2014 by Jeff Shepard
1206 Size Wire-in-Air Surface Mount Fuses

1206 Size Wire-in-Air Surface Mount Fuses

new products Sep 21, 2014 by Jeff Shepard
30W Encapsulated PCB-Mount AC-DC Power

30W Encapsulated PCB-Mount AC-DC Power

new products Sep 18, 2014 by Jeff Shepard
Cold Forging makes High-Performance Thermal Modules

Cold Forging makes High-Performance Thermal Modules

new products Aug 13, 2014 by Jeff Shepard
40A Electric Vehicle Charge Connector Assembly

40A Electric Vehicle Charge Connector Assembly

new products Aug 03, 2014 by Jeff Shepard
Surface-Mount Precision Thin-Film 6W AlN Chip Resistors

Surface-Mount Precision Thin-Film 6W AlN Chip Resistors

new products Jul 30, 2014 by Jeff Shepard