Nextreme Raises $8 Million In Corporate Funding

July 07, 2009 by Jeff Shepard

Nextreme Thermal Solutions announced that the company has raised $8 million in additional Series B financing from undisclosed corporate investors. Nextreme has now raised more than $21 million in Series B financing and $35 million since its inception in 2004. The additional funding will be used to expand Nextreme’s presence and products for energy harvesting for micro and portable power along with solidifying its position for thermal management products in computing, consumer and mobile markets.

Nextreme offers microscale cooling and thermal energy harvesting solutions that integrate directly into electronic and consumer product packaging. Nextreme’s scalable cooling and power generation solutions have the potential to have a major impact on mainstream industries such as automotive, computing, consumer, mobile, and telecommunications. Applications for the technology include: CPU/GPU hot spot cooling, power MOSFET cooling, LED cooling, laser diode cooling, thermal energy scavenging, thermal control in consumer products, power harvesting for sensors, and process control.

"This funding from corporate investors represents a very significant validation of our company and technology, especially during these challenging times," said Jesko von Windheim, CEO of Nextreme. "With our Series B financing now fully in place, the company is well positioned to execute its product development and sales plan over the next two years."