Tessera Technologies Inc. (San Jose, CA), a developer of semiconductor packaging technology for miniaturization of electronic products, reported that NEC Electronics Corp. has inked a new licensing agreement with the company.
The licensing agreement enables NEC Electronics and its subcontractors to use a broad range of Tessera’s chip-scale and multi-chip package technology, including integrated circuit devices packaged in "face-down," "face-up," "fold-over," "stacked" and "system-in-package" formats. The formats use many types of materials, such as packages with either tape or laminate substrates, marketed by Tessera as MicroBGA for face-down orientations, MicroBGA-F for face-up orientations, and MicroZ for multi-chip solutions.
NEC Electronics currently uses Tessera’s technology in a variety of semiconductor devices, including ASICs, application-specific standard products and logic devices, which are integrated into a variety of products, including wireless communications devices, consumer products and computing electronics.
