DuPont Electronic Technologies (Wilmington, DE) reported that it would license buried capacitance technology from Sanmina-SCI Corp. (San Jose, CA), an electronics manufacturing services provider, in order to meet OEM demand for PCB planar capacitance materials at 25 microns and below. Also, DuPont Interra HK polyimide laminates will now be available to Sanmina-SCI's existing family of licensed PCB manufacturers.
"Due to the continued acceptance and market growth for 1 mil (25 micron) and below planar capacitance materials in PCBs, several major OEMs requested that we license a second source for film-based, buried capacitance products to complement the current line of licensed FaradFlex materials from Oak Mitsui Technologies (OMT)," explained Sanmina-SCI's PCB and Backplane Divisions Senior Vice President and CTO.
The licensing agreement between the companies gives access to a variety of buried capacitance materials in the 0-mil to 4-mil dielectric thickness range, including OMT's FaradFlex line of 1-mil and sub 1-mil dielectrics, and now DuPont Interra HK04 and HK 11 polyimide laminates. The benefits of using buried capacitance technology can be seen in a variety of areas, particularly in the reduction of high-frequency electromagnetic interference, and in a quieter power distribution system. Buried capacitance also potentially reduces many bypass capacitors from the surface of a PCB, which equates to assembly cost reductions and increases the available surface area for increased circuit-routing density.
